W E D E L I V E R

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Nov 2, 2013 (4 years and 1 month ago)

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W E D E L I V E R


Juniper QMR Q405

Jan 18, 2006

2

Agenda

3

Thomas Porinchu

Test & Quality Engineering Manager

Naresh Seth

Test Team Lead

Ala Mwas

FA Focal Point / HFE

Roula Naoum

Product Owner

M
-
Series

James Liu

Quality Team Lead

Acting System Build QE

Aileen Kuang

QE

Bipin Bhatt

QE

Jules Varenikic

Data Reporting

Quality and Test Eng Organization Structure

Alan Milosevic

S/W Lead
Infra’/CI/PICs/Pilots

Solomon Habtom

SPG/SW Support

JF Daigle

Product Owner

T
-
Series/TX Matrix/Stoli

Gary Johnson

LSE

RE/PS/Electrical/Optics

Adrian D’Souza

LSE

Sheet Metal

Cheryl Nopuente

Quality Support

Huiling Zhai

Quality Support

Michael Li

LSE

PWB/PCB/Mid
-
planes

Debbie Liddicot

ICT ETS

Fareshta Hashemi

ICT Team Lead

Mano Somasundaram

ICT

4

Measurements

Results

DOA (Q3)



CLS: .12% Vs. .18% Target


JNPR: .04% Vs. .07% Target

Card Level Test



10/12 (83%) of tracked products met targets

ICT



15/19 (79%) of tracked products met targets


DPMO



26 ppm vs. 60 ppm Target


All 6 technologies met targets


Q4 Quality Performance Summary

Front End Quality

(SMT to ICT)


Juniper QMR Q405

Jan 18, 2006

6

Q4’05 Technology DPMO Summary


7

Other Technology DPMO Trend Charts

50% of 25 MIL defects are related to 4 products.
Location or PN trends identified. Actions are to be
taken to address different defect types in order to
perform lower than targets.

8

Q4’05 ICT Yield Results


Note: For all pass & scrubbed yield, only true process defect is considered as failure.


9









VT223 uBGA
-

Electrical /Damage Related Failure


40% electrical failure is related to Volterra uBGA. Root cause is under investigation.


25% damage defects are at uBGA locations. These uBGAs could be damaged at Mechanical Assembly
area since most damaged boards have already gone through ICT 1
st

time.


Pin not Through


FCI connector 450
-
002408


Incoming connector pin misalignment issue was addressed with FCI (SCAR 4283

closed in Q4)


Ongoing meetings facilitated by the 6 sigma black belt have been conducted to investigate further on
other potential causes on the top of vendor quality.


Raw card and connector specs will be verified by LSE (G. Johnson, Jan 20).


Some failed boards are to be investigated to see whether tolerance stack
-
up is the cause. (TBD by Jan 20)


Compare process fallouts across different products. (M. Li, Jan 20)




Q4’05 ICT Yield Summary (Continued)

10

Q4’05 ICT Yield Summary (Continued)




Pin not through is the main defect for
M320 SIB ICT failure


FCI Connector
450
-
002408 (see previous page)


Bridging/Solder splatter defects
occurred at PTH/SMT/Test via
locations. Wave fixtures to be
examined for cleanliness.


No significant statistical trend for
electrical failure.


11

TTM PWB CSP Pad Issue in Q4’05








TTM PWB (M320 FPCs) solder mask & silk screen covered CSP pads.


High electrical failure in Q4 (failure rate 3.5% on component level).


CSP pad undersize and covered with solder mask or misaligned silk screen.
At some critical pin locations, the solder mask opening is about 3
-
5 MIL,
significantly smaller than the specified value (11 mil).







Pad Width:
5 MIL


Pad Width:
3 MIL


12

TTM PWB CSP Pad Issue in Q4’05
(Continued)

Containment & Corrective Actions:


About 800 raw cards were sorted by CLS to support quarter end and Jan
build requirement.


M320 FPC PWBs have 5


13% defect rates. No issue was identified on
T320 FPCs.


SCAR issued to TTM. RCCA provided by TTM on 01/13/2006. Incoming QA
inspection to set up for verification.




Back End Quality

(Post ICT)


Juniper QMR Q405

Jan 18, 2006

14

Process

Results

DOA (Q3)



CLS: .12% Vs. .18% Target



JNPR: .04% Vs. .07% Target



Major contributors: Mechanical Damage: Connectors,
PCMCIA Ejectors and Loose Heat Sinks

Card Level Test



10/12 (83%) of tracked products met targets



Gibson FPC (87% vs. 88% target), 44% due to
electrical defects



T320E FPC (89% vs. 93% target), 68% of total
defects were due to electrical defects, 65% of the
electrical defects were related to Volterra uBGA


JIA



Major contributors: Damaged EMI clips and Loose
Heatsinks

LTI


Major contributors: Damaged connectors,
damaged/missing labels

Q4 Quality Performance Summary

15

Q405 Card Level Test Yield Summary

FCT

Q2 TARGET

Q3 TARGET

Q4 TARGET

Q4 ACTUAL

PC PICs

93%

96%

96%

99%

SFM

84%

93%

93%

93%

T SIB

74%

89%

90%

91%

SIB
-
M

85%

94%

94%

94%

CB
-
L/S

85%

94%

94%

95%

CB
-
M

85%

85%

86%

92%

M40e FPC

85%

87%

87%

91%

FPC G

87%

87%

88%

87%

FPC T

72%

87%

87%

94%

T640 E
-
FPC

82%

88%

89%

90%

T320 E
-
FPC

85%

92%

93%

89%

M320 FPC

81%

87%

88%

88%

16

2005

Q1 Actual

Q2 Actual

Q3 Actual

Q4 Actual

PICS

96%

96%

93%

99%

SFM

93%

95%

90%

93%

T SIB

91%

89%

92%

91%

M SIB

97%

90%

97%

94%

CB L/S

94%

96%

94%

95%

CB M



86%

95%

92%

M40e FPC

88%

87%

87%

91%

FPC T640



87%

94%

87%

FPC T320

87%

92%

89%

94%

T640 E
-
FPC

88%

89%

85%

90%

T320 E
-
FPC

94%

92%

88%

89%

M320 FPC

88%

89%

92%

88%

2005 Card Level Test Yield Summary

17

Gibson FPC Card Level Test Fallout Pareto

Low volume in the forth quarter

Random failures, mostly ASICs electrical defects: L
-
chip, R
-
chip, N
-
chip,SRAM.


18

T320E FPC Card Level Test Fall Out Pareto


More than 65% of electrical fails were related to Volterra uBGAs.

Other 22% are related to L
-
chip, R
-
chip, N
-
chip, SRAMs

19




DOA Rate Summary


Top Product Contributors:


Overall:

0.16%

CLS:

0.13%

JNPR:

0.03%

20

JIA/LTI Defect Pareto

21

LTI Defect Pareto

CLS Internal CAR
updates


Juniper QMR Q405

Jan 18, 2006

23

CARs Launched in 3Q

Prioritization matrix was established
and the team will be focusing on the
following areas:



MPI was revised and
released to check for
connector flushness. All
operators have been trained
to do the inspection.



Review current PM plan of
Testers and Silver WIP at
Card Level Test, 1Q06.







Bent Pins / Connector Damage

24



Based on the data, majority of fails happened on PICS without rails on
the sides of the PCBA. The clearance provided by the rails will minimize
handling impacts on components
.



Knocked Off Components

25


CTO also changed the orientation of PICs storage in order to minimize
bottom side component damage



Knocked Off Components (PICS)

Storage tote orientation change has been

in effect since September 20, 2005 on the

worst offenders: Gibson OC192 (99ZD)

and PC
-
1GE
-
XENPAK (JN05).

Both of these PICs do not have side rails.

However, still seeing 46 and 17 knocked

offs after implementation in Q4




26



Primarily caused by rivets protrusion
underneath the overlay or burrs around the
rivet’s hole



CMY team has implemented inspection step
before overlay application.



CMY team to feedback concerns to
suppliers if any



CTO to monitor corrective action
effectiveness






Cracked Overlay

Design Related
Issues Update


Juniper QMR Q405

Jan 18, 2006

28

Electrical Violation: T Switch

Description of Issues


FA has recently seen a lot of SIBs which have failed at RIT due to power on/fault issues. Some of these SIBs fail RIT
right away, most are taking a few hours to fail. After some debug, the root cause has been narrowed down to push
button switch at S3250. This switch which should be open, will become short after it heats up and will cause the SIB to
go offline. We've had 34 incidents of this in Q3. Further investigation indicates that due to the design of the switch, the
stabilization bar could violate the minimum electrical clearance (<.005") when assembled on a board and make contact
with the barrel besides it.









29

Omron Vs. HDK

Based on CLS findings, all HDK parts were purged and OMRON would be
the only parts CLS will use for future production until further notice from
JNPR.

30

Electrical Violation: Southland DIMM

Description of Issues


In many FPC3 cards one DRAM Release latch gets too close to DRAM component pins when it
snaps into place to secure the DRAM. The Release latch is made of metal and is connected to
FPC ground. It seems like the Release latch in some cases might be able to short
-
circuit one or
two component pins to ground or two pins to each other.

Analysis


Based on the drawing and JNPR Design team’s inputs, there should be .006” clearance on each side between
the clip and the pin. However,
CLS has confirmed with the PCB manufacturer that the master pattern
image location accuracy is maintained to +/
-

0.003 inch. Therefore, in theory, if the image shifted for
.003”, a clearance of .006”
-
.003”=.003”could be observed on one side and violated the electrical
clearance for both IPC and JNPR’s specification


JNPR design team to review findings


Alternate supplier (SMART) to be considered to

buy from








31

Design Related Issues



Loose Short Gaskets, phase in ECOs
released:

ECO
-
06781 has been implemented affecting parts:


760
-
013077 (M320 FPC1 Carrier)


760
-
013078 (M320 FPC2 Carrier)


760
-
013079 (M320 FPC3 Carrier)


760
-
013080 (M320 FPC Blank)

ECO
-
07036 has been implemented affecting parts:


760
-
012845 (T320 FPC1 Carrier)


760
-
012846 (T320 FPC2 Carrier)


760
-
012847 (T320 FPC3 Carrier)


760
-
012849 (T320 FPC Blank)

ECO
-
07139 has been implemented affecting parts:


760
-
013134 (T640 FPC2 Carrier)


760
-
013135 (T640 FPC3 Carrier)


760
-
013136 (T640 FPC Blank)


760
-
013580 (T640 FPC1 Carrier)


.


Other ECOs are still in progress


32



Loose rivet mandrels


M320 had quite a few grip range violations.
The closed end rivet proto is underway. ECO
was to be released in early 3Q. T640 and
Hobson have less grip range violations and will
unlikely require closed end rivets.



ECO7174 to be released

Outstanding Design Related Issues

33



Damaged Card Guide EMI Clip



JNPR is currently investigating moving
the clips a row back or simply
eliminating this row of EMI clips.



Experiment still in progress at JNPR

Outstanding Design Related Issues

34

Objectives

Actions

Resolve Heat
Sink Issues



Process parameters have already been modified, non
-
conforming batches from PENCOM China to be resolved

Volterra uBGA



Continue to work with JNPR and Volterra to resolve
high fallout issue on uBGA. TTM corrective actions to be
verified

Design
Improvement



Southland DIMMs, EMI clips, Gaskets, Loose Rivets
Mandrels



Guide Rails for PICs currently without (eg. Gibson
OC192 (99ZD) and PC
-
1GE
-
XENPAK (JN05) in order to
avoid knocked off.

Incoming
Quality



Continue to work vendors (NG, Tenere) to reduce
Midplane and fan tray NDFs



Continue to work with TTM to resolve solder mask and
silkscreen registration issue




Q1 Quality Outlook

35

Objectives

Actions

CARs



Continue to drive closures for the 3 internal CARs
especially for bent pin/connector damage

Quality
Reporting



Combine scrubbed and unscrubbed yield report



Component electrical failure report to be released by
using NCM data



Kulim incoming quality report to be developed



2006 targets to be established

Process
Conformance



Action plan to be developed to assure process
conformance

ECO Follow Up



Action to be developed to assure there is a closed
loop communication between CLS and vendors to
assure effective communication on ECs


Q1 Quality Outlook

ICT Engineering


Juniper QMR Q405

Jan 18, 2006

37

Priority Product Results

NDF finished at 12% improved from
17%

38

37 Priority Products:




7 products below volume clip of 30



not included in score, despite that fact these products all showed
improvement over previous quarter numbers




Of 30 boards remaining:



21 met target



5 products exceeded target



4 missed target





Score: 8.66/10

ICT Performance

39

Priority boards meeting and exceeding target

710

Name

CLS Barcode

13 Week
Volume

Target

Lower C.I.

13 Week
NDF

Upper C.I.

11159

M160
-

FPC2

8090

54

28%

23%

34%

46%

5839

Hobson SIB
-
S8
-
A

8006

39

18%

15%

26%

40%

5840

Hobson SIB
-
S8
-
B

8007

45

18%

11%

20%

33%

11709

Hobson CB
-
TX

8010

32

22%

7%

17%

32%

11725

FPC1, B
-
Chip

803E

135

14%

12%

17%

23%

5197

M40E FPC2

8092

96

22%

8%

14%

21%

1226

MCS
-
M160
-
S

97Q5

208

17%

9%

12%

16%

3066

M160
-
PCG
-
S

97Q6

209

5%

5%

8%

11%

2483

PB
-
4DS3

97VP

82

6%

6%

11%

19%

3618

PC
-
1OC192
-
SON

98D7

37

7%

4%

11%

23%

4597

PB
-
4CHDS3
-
QPP

99ME

60

10%

3%

8%

17%

4455

SCG
-
T320

99MS

90

10%

1%

3%

8%

4461

FTB

99MT

48

7%

0%

2%

10%

5860

T320
-
FPC1

99P1

32

27%

23%

38%

54%

7531

T320
-
FPC2

99P2

81

12%

10%

17%

25%

7532

T320
-
FPC3

99P3

85

14%

4%

9%

16%

10157

T640
-
FPC2
-
E

99YP

54

22%

21%

31%

43%

10912

T320
-
SIB
-
E

99YV

256

10%

4%

7%

10%

10163

T320
-
FPC2
-
E

99ZK

37

22%

20%

32%

47%

10160

T320
-
FPC3
-
E

99ZL

92

20%

8%

13%

21%

10614

PB
-
2GE
-
SFP

99ZP

180

5%

2%

4%

8%

10419

M320
-
FPC1

ST01

153

14%

10%

14%

21%

8997

M320
-
FPC2

ST02

162

18%

9%

13%

18%

9141

M320
-
PMB

ST04

1289

10%

6%

8%

9%

9115

M320
-
CB
-
VCS

ST09

642

15%

10%

12%

14%

9184

M320 V
-
SIB

ST14

1259

10%

10%

12%

13%

11212

10GE FPC

8097

18

36%

12%

28%

50%

4617

Hobson FTB
-
S

8004

12

10%

3%

18%

47%

10218

Hobson CIP
-
S

8005

17

7%

0%

6%

25%

7655

Hobson CB
-
TX

8011

0

22%

0%

0%

100%

10233

T640
-
FPC1
-
E

99YN

28

15%

7%

18%

34%

10166

T320
-
FPC1
-
E

99ZJ

18

22%

12%

28%

50%

9554

PC
-
4OC48
-
SON
-
S

JN07

0

15%

0%

0%

100%




Legend:



Light green: target met


Dark green: target exceeded


Light blue: insufficient Volume


40

Q4 Highlights

710

Name

CLS
Barcode

13 Week
Volume

Target

Lower
C.I.

13 Week
NDF

Upper
C.I.

Reason

10174

4
-
port GAP
-

Enhanced
GE Bottom Board

8088

260

15%

20

25

30

U5, U6, and U7 Connect failures
Root cause: Boundary Scan instability Work done
on 051209, have not seen further occurrences

8923

E
-
MMB2MD

99YS

100

10%

16%

23%

31%

High fallout at Testjet test, more focus will be
required in Q1/06

9178

M320
-
FPC3

ST03

108

8%

10%

15%

22%

Various failures fixed throughout Q4, more focus
will be required in Q1/06 on Boundary Scan
instability issues

9143

M320MMBM2.0forFPC1

ST05

799

5%

8%

10%

12%

Boundary Scan instability
-

did not focus on this
problem this quarter, more focus will be required
in Q1/06

Priority boards missing target and Reasons

41

Overall Product Result

NDF finished at 11%

42

ICT Activities

Q4 Summay



Priority and overall product trends continue to be positive, lowest NDF rates to date
for priority products:



Priority boards improved on NDF by 29.4%



Completed Phase 1 and Phase 2 transfer to China



Released 3 new fixtures (CB
-
L
-
T, PMB, and ICE PIC) into production



CB
-
L
-
T and PMB are replacement fixtures for existing Stealth fixtures



T640
-
E
-
FPC3 and E
-
PMB Pilot and Qualification builds were completed



T640
-
E
-
FPC3 new fab has now cut
-
in and we already seen NDF improvements,
around 15% compared to 28% in end of Q1/05



increased coverage on the G
-
EFPC3 due to the fab spin



Opened SCAR against ECT, resulted in removal of supplier from vendor list until
proven reliable on other customers

43

Looking Ahead

Q1 Outlook


Continue to focus on the priority boards to improve NDF levels



Transfer of Phase 3
-
5 products to Suzhou



Continue to track issues with weekly tracker and customer calls



NPI support for Stoli product

Test Engineering


Juniper QMR Q405

Jan 18, 2006

45

Q4 Outlook

Highlight

Actions & Results

China
(Suzhou)
Transfer



Actively participated in China Transfer activities


Assessment, Planning, Training, Guidance

On
-
going
Reliability Test



Explored possibilities of performing ORT on
existing/upcoming Juniper Products with Senior
Management / Engineering team

TTR Analysis
(M & T


Series)



Performed and presented RIT test time reduction
analysis on Q2 and Q3 data for M & T
-
Series platforms



Decision made to reduce the RIT test time from 24
hours to 12 hours

Stoli Pilot
Readiness



Prepared and presented test readiness plans for Stoli
pilot build



Attended on site Stoli program training at Juniper

Q4 Highlights

46

Q4 Outlook

Highlight

Actions & Results

Design
Verification
Test



Performed DVT on 2 platforms to validate heat sink
issue and verify new heat sink attach process

Swap FPC Cell



Coordinated implementation of power and network
required for new swap FPC cell


Configured and released test infrastructure (celboxes,
Chassis) required for CLT for swap FPC cell

Throughput
Burst (Quarter
End)



Rapidly reconfigured backplane test bays for CLT



Facilitated RIT test time reduction deviation

Test Capacity



Maximized the test capacity at system level factory with
addition of power drops and celboxes



Added additional terminals in shipping area

Q4 Highlights (Cont’d)

47

Back End Yields

Highlights



Continued strong performance with
record volumes in Q4



Increased throughput in historical
hot spots


BPTEST, RIT



High performance facilitated RIT
test time reduction

Areas of Concern



M
-
Chip fallout


Identified to
specific data code



TxMatrix Fan Tray fallout



Voltera component fallout


Identified as raw card issue

48

Q4 Outlook

Highlight

Actions & Results

China
(Suzhou)
Transfer



Active Participation in China Transfer activities



Readiness for Phase V transfer

On
-
going
Reliability Test



Define Total ORT process and prepare implementation
model



Readiness to start ORT on new programs

CLT
throughput
Improvement



Confirm improvements to retest rates due to TPM



Define roadmap for future improvement

RIT NDF
Project



Rollout of CleanBlast optical cleaning/inspection tool to
manufacturing to collect data for DOE (Design of
Experiment)

Q1 Outlook

49

Q4 Outlook

Highlight

Actions & Results

Design
Verification
Test



Streamline the process flow for DVT material



Readiness to perform upcoming qualifications

Stoli Pilot
Build



Readiness to execute a successful pilot build for Stoli



Preparation to release Stoli program to manufacturing

OOBA
automation
release



Release of fully automated process to identify and
validate OOBA samples

Full release of
FADA tool



Release of automated data extraction tools



Generate accurate FRU level reports for backend
process on weekly basis



Fast detection of FRU Level quality issues

Q4 Outlook (Cont’d)

Supplier Quality
Management


Juniper QMR Q405

Jan 18, 2006

51

Supplier Quality Engineering

Supplier Quality Engineering


Six Sigma project completed to minimize RMA Assembly “NDF” issue.


On
-
going Six Sigma project to reduce pressfit connector defects.


Completed TTM audit.


Joint NTF problem solving imitative with NG and Juniper


set up the baseline


18 SCARs issued, 54 AVL purges requested.


TTM CSP pad issues were identified.





52

Supplier Quality Engineering

SCAR Highlights:


Tenere:
wrong fastener, plating discoloration, missing pem nuts, overlay discoloration
,
missing


revits wrong pem nuts inverted overlay, misaligned holes



SCAR
-
TOR
-
4268:

760
-
001818JNS
-

Vendor used incorrect southco fastener on carrier.



SCAR
-
TOR
-
4270:

540
-
007788JNS
-

Discoloration in plating on the surface of the side panel


760
-
009402JNs
-

wrong southco fastener used on carrier. Unable to install carrier on chassis



SCAR
-
TOR
-
4340:

540
-
004659JNS
-
Parts are missing pem nuts


SCAR
-
TOR
-
4364:

760
-
009186JNS
-

Discoloration on overlay on carrier


760
-
009402JNS
-

Discoloration in plating on carrier


SCAR
-
TOR
-
4269:

760
-
012902JNS
-
Midplane does not align with holes on midplane support,


Distance between holes on midplane support must be 16.250 +/
-
0.0
05.



SCAR
-
TOR
-
4347:
760
-
009870JNS
-

Rear fan blowers failed electrical test due to reversed cables connecting the


TOP and BOTTOM connectors



SCAR
-
TOR
-
4355:

760
-
013080JNS
-
Carriers have shorter lengths of southco fasteners



SCAR
-
TOR
-
4365:

760
-
001818JNS
-
Missing rivets on flange & Southco fastener not installed on carrier


760
-
009344JNS
-

Wrong pem nut installed on rear card cage of chassis


760
-
005177JNS
-

Inverted overlay on carrier



53

Supplier Quality Engineering

SCAR Highlights:

Encore:
Missing parts, wrong parts used, damaged parts, dimension out of spec

SCAR
-
TOR
-
4312
760
-
004758jns
-
Missing overlay on carrier


760
-
002304jns
-
Wrong head on southco fastener


540
-
001384jns
-
Rust on surface of carriers


760
-
004807jns
-
Body length of rivet is too high


760
-
004807jns
-
Damaged standoff on carrier

SCAR
-
TOR
-
4310
760
-
004771JNS
-

Hole not centered during pem insertion


760
-
002304JNS
-
Hole not centered during pem insertion


Sanmina
-
SCI: Dimension out of spec, discoloration, improper assembly


SCAR
-
TOR
-
4320:

760
-
004123JNS
-
Overall width of the carrier is out of spec


760
-
005599JNS
-
Cannot insert carrier into chassis


760
-
004123JNS
-
One side of carrier is not formed correctly

SCAR
-
TOR
-
4321:

760
-
005599JNS
-
Discoloration in plating on carrier


760
-
005598JNS
-
Discoloration in plating on side of carrier


FCI
:
Pressfit connectors out of spec



SCAR
-
TOR
-
4283:
102740C
-

misaligned, bent and split connector pins, packaging tubes out of spec.



54

Supplier Quality Engineering

SCAR Highlights:

Everett Charles Technologies:


SCAR
-
TOR
-
4312
: ICT Fixture defects



Details:
Celestica Checklist not filled out for 3 of 4 fixtures, .Non
-
pop locations were not milled out on


top plate, All pockets for larger chip capacitors missing., fixtures had no weight stickers


TTM:
Solder mask missing, raw card corner indentation


SCAR
-
TOR
-
4342:
510
-
011030JNS
-
Solder Dam mask missing at NexLev locations

SCAR
-
TOR
-
4358:
510
-
010805
-
Raw card corner indentation


Northrop Grumman:
Misoriented connector


SCAR
-
TOR
-
4209: 710
-
008502
-

Misoriented connector




Manufacturing
Engineering Updates


Juniper QMR Q405

Jan 18, 2006

56

Manufacturing Engineering

Terry Rutledge

Mfg Eng Manager

Uthayan Rajenthiram

M320/Chaser/STOLI

Tanveer Khan

SPG, T640,

T320 FPC,

E
-
FPCs

Ratna Thayalan

M40e/M160

Hewley Luckhoo

TX Matrix, Saipan,

DFA

Sebastian Enachescu

SMT Cell

Kevin Kim

SMT Cell

Adil Sidaros

PCBA Cell

Korry Frew

BTO Cell

Arun Thangavelu

T320

Chris Barlosky

PCBA Cell

Zulfikar Hathiyani

All PICS

Al
-
Karim Murji

Team Lead

Joe Kennedy

BTO Cell

Updated January 13, 2006

57

Q4 Outlook

Highlight

Actions & Results

Heatsink Issue



Field support provided in Norway for Telenor heatsink
failures.



Completed two major purges and screens on FPC and
SIB HS failures in late Q4 with relatively minimal
disruption to the backlog.



Performed extensive analysis on coverage and lap
shear on 3M 8815 and Bergquist BP 111 tapes to re
-
establish process/material capability.



Worked with Juniper on validation and quick
implementation of IBM HyperBGA spec to increase
application load from 5 PSI to 15 PSI.



Providing input/feedback to a new standard Juniper HS
application and inspection specification. This will
address all thermal tape heatsinks and standardize
application by package at all CM sites.

Q4 Highlights

58

Q4 Outlook

Highlight

Actions & Results

Miss Ships



Conducted a pack error proof blitz to eliminate
opportunities for error during the pack process.



Received support and participation from Dave Shinn



Eighty five opportunities were identified of which 73%
were addressed.

Flex and
Capacity



Designed and implemented a fourth mechanical
assembly cell to increase FPC capacity including a
second pneumatic heatsink press.



Added a second wave solder cell



Optimized BTO cell layout to increase portable hot box
RIT capacity by 12 bays.

ECO Activity



Implemented 235 ECO's in Q405. The number of
CCB's quoted was 176.

Q4 Highlights

59

Q4 Outlook

Highlight

Actions & Results

Product
Transfer
Activity



Completed PC PIC transfers to CMY. Qualification
reports were sent to Juniper.



Supported the ICT fixture transfer activities to CSU.



Completed full build and testing of 254 SAIPAN chassis
in conjunction with CSU, CMY and Juniper teams. All
chassis were shipped and reports were provided.

Quarter end
product
support



Reclaimed 91 pieces of connector 450
-
002738 due to
a part short. Shipped 77 FPC’s to support quarter end
requirements as per Dev


1375.



Implemented T640 and M320 FPC builds with 16M
SRAM/R2.1 chip combinations due to shortages with the
32M SRAM as per Dev


1350.


Q4 Highlights

JQI Updates


Juniper QMR Q405

Jan 18, 2006

61

JQI Updates

Overview


3 JQIs progressed towards closure in Q405.


J
-
QI
-
20050711
-
001(Misships) CLS is working to close out the
improve phase based on feedback from JNPR and validation data.


J
-
QI
-
20050726
-
001 (Cycle Count Accuracy) CLS is working to
finalize the implementation of improve phase actions.


J
-
QI
-
20051110
-
001 (Heat Sink issue) CLS working with JNPR to
finalize the M&A phase and move to the improve phase.



CLS is targeting closure of all three JQIs in Q106

62

Outstanding Action Items From Last QMR





END


THANK YOU !!!




Juniper QMR Q405

Jan 18, 2006