SEMICON/Japan Industry Briefing

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Nov 1, 2013 (3 years and 10 months ago)

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SEMICON/Japan

Industry Briefing

December 5, 2012

Executive Summary


The Program has achieved critical momentum



Tools selected for program demonstrations


Broad coverage of tool set and Supplier base


Tool optimization added to program scope



Coordinating across Industry on
precompetitive opportunities


Global 450mm Consortium


A public/private program based at the College of
Nanoscale Science and Engineering in Albany, NY


Driving effective industry 450mm development


Coordinate test wafer capability supporting development


Demonstrate unit process tool performance


Improve tools with Suppliers to ready for customer operations


G450C Members


CNSE / Research Foundation


GLOBALFOUNDRIES


Intel


IBM


Samsung


TSMC



GM/VP and Coordinator

Paul Farrar, CNSE

G450C Program Organization

Director,

Integration


(Samsung)

Director, Program

Coordination


(Intel)

CVD/PVD/Implant

Engineering Director

(IBM)

Co
-
directors,

Fab Operations


(CNSE/TSMC)

VP/ GM, Internal / Operations

John Lin, TSMC

VP/GM, Industry / Strategy

Frank Robertson, Intel

Lithography

Engineering Director

(GLOBALFOUNDRIES)

CMP/Thermal/Cleans

Engineering Director

(TSMC)

Etch Engineering

Director

(Samsung)


Industry consortium coordinated by not
-
for
-
profit entity


Leveraging New York State funding, matched by all industry participants


Broadly
-
shared management of Program execution


>60 staff on board now; >150 by 2014, with ~60 Supplier engineers on site

4



Development and Technology
Intercept
Targets

------

2010 2011 2012 2013 2014 2015 2016

Early Development

of Silicon and factory
integration / automation standards,
interoperability
test beds
for component and

standards
verification; early
tool development

G450C Program

ISMI
32/22nm Equipment
Performance Metrics

10nm
and
beyond

Tools
for Consortium
Demonstrations
(unit process)

Ready for IC Makers

Early 450mm Development

Test Wafers to support development and demo

14nm G450C Demonstrations

5

450mm
and
300mm
tools progress
synchronously through
technology generations

Full

set of
process
and
metrology, automation

Nominal “nm” = ITRS M1 Half Pitch

Supplier Tool Development

Tool Demo /

Improvement

G450C
TW

Cleans, Blanket Films, Etch, etc.

Bare Wafers

Imprint /Spacer doubling, 300mm Coupons

193i on 450mm

Metrology

Increasing scope and complexity of process / metro capability

Manufacturing Execution Systems, Engineering Data Collection and
analysis tools, Virtual Fab logistics for globally
-
distributed tool set


Alpha


Beta



Pre
-
production

Wafer pool coordination for multiple use, re
-
use, reclaim

2011


2012


2013


2014


Test Wafer Support for Tool Development

6

Baseline
Report

EMA

Gauge Study

PDC

MDC

DOE

Marathon

D
evelopment

Supplier Testing


Demo Tool

Test Plan

Tool Improvements as Indicated by Pareto

Tool Ready for
Customers

G450C
Demo

Increasing tool maturity and data
-
based confidence

Demo
Report

EMA
Report

Tech Transfer

Standardized methods and consistency across all tools

2012


2013


2014


2015


2016


Demonstrations Drive Tool Improvement

7





450mm Equipment Development




Tool Selection Overview


Immediate
o
bjective:


Select at least one Supplier for Priority 1 and 2
tools for negotiation of Demo / full flow @ CNSE


Criteria:


Technical and commercial scores from RFQ


Balance across competitive Supplier base


Benefit to all Members and NY State


Process:


Research Foundation RFQ


Member selection teams used pre
-
agreed criteria


Management Council approved recommendation


Closing deals with selected Suppliers

10



450mm
Cleanroom

in CNSE (NFX)


Cleanroom

ready by January 2013; First tools installed March 2013


450mm OHV is ready, could carry 300mm FOUP in 450mm inter
-
bay


4 stockers with 1000 bins ready in Feb 2013

G450C

11



G450C Test Wafers/
Operations



Wafer Availability


Initial order for 6000
sc
-
Si (SEMI M76)


Growing capability to meet 2013 need


Initial order for 2000 cast wafers (SEMI M74)


Provision for wafer handling needs


Bring up additional supply in 2013


> 15,000 wafers and progress to prime quality
(SEMI M1) needed next year


Exploring engagement with multiple Suppliers

Establish roadmaps for cost / quality learning

13



Wafer Industry Support Model


Suppliers providing tools for the program get access to
test wafers at significant discount to individual purchase


Program expansion:


Suppliers without tools in the program can also get
discounted cost if they return wafers and provide data


Suppliers may take advantage of program volume
aggregation to procure wafers at consortium cost


Wafer pool managed for budget, allocation to needs


Pass on our costs beyond program capabilities for TWs

Adjust for wafer costs, reuse/regen, scrap rates, etc.

14



Wafer Cost Sharing


To support 450mm development and maintain
Consortium budget, wafer cost will be shared with
industry


G450C will be loaning wafers for a given duration, at a
shared cost (wafers available for purchase at 100% of
G450C cost)


G450C cost share represents a
considerable

discount
from independent small volume purchases


Factors for cost share will include usage/needs,
reuse/
regen
, wafer loan duration, scrap, etc.


Test wafer process/metrology capability ‘Menu Card’
being developed for industry needs


For wafer request/loan discussion, more information
available at:

http://www.g450c.org/wafer
-
loan.aspx


15



Wafer Quality Continues

to

Improve

Most recent ~ 66
@ 38nm
sensitivity

August 2012: ~5
defects/wafer


2011:
~ 175

defects/wafer


2012:
~50

defects/wafer


2010: >
3000

defects/wafer

Defects per wafer reduced significantly

(@ 90nm sensitivity)

Defects / Wafer

Year
-
to
-
year comparison using >90nm defect size recipe

Migrating to 40nm and below

16

17

Process

Film

Tool/service

2012 4Q

2013 1Q

2013 2Q

2013 3Q

2013 4Q

10

11

12

1

2

3

4

5

6

7

8

9

10

11

12

FEOL

Oxi de

Cl eani ng tool Suppl i er



Pol y



Si N



PR



Wafer Quality Roadmap & Reclaim Capability

Supplier side

G450C On
-
site



Wafer quality roadmap

M74 Spec

M76 Spec

2012

2013

2014

2015

2016

1H

2H

1H

2H

1H

2H

1H

2H

1H

2H


M62 Spec

M1 Spec

Q2, 2014

Q1, 2015

Wafers meet SEMI spec


SFQR meet (~90% area)


Particle (~70% pass rate)

Q2, 2013


FEOL wafer reclaim capability

Mechanical Wafer

Test / Mon Wafer

Prime Wafer

Epi Wafer

Test Wafer Routes (Menu Card)

Route name

Route Description

5

Oxide film
-

thermal 110A

A

Oxide film
-

thermal 1000A

B

Oxide film
-

thermal 5000A

4

Oxide film
-

PECVD 1000A

D

Implanted wafers

E

PR wafers

F

PR wafers + implant

G

PR wafers

I

patterned wafers

J

Nitride film
-

LPCVD 1000A

K

Nitride film
-

LPCVD 2000A

L

Poly film (1000A)

M

Poly film (3000A)

O

Nitride film
-

PECVD 200A

Q

TiN film (1000A)

V

Bare wafers

W

Bare wafers Mechanical

Route name

Route Description

4a

Oxide film
-

PECVD 1000A

C

Low
-
K film

N

Ni film

P

TiN film (600A)

R

W film

S

TaN film

T

Cu films

U

Al film

Vbe

Bare wafers

Front End

Metals



Metrology Readiness


Metrology capability expanding to support virtual test wafer
operations


Tool Type

Forecasted Ops
Ready In Japan

Forecasted Ops
Ready in New York

Supplier

Hosted
Metro Site

Advanced Bare Wafer
Inspect

Operational

Operational

Ellipsometer
/
Scatterometry

Operational

1st Tool Operational

2
nd

Tool Ready
December 2012

4 pt Probe

Operational

Operational

AFM

January 2013

Operational

TXRF

January 2013

Operational

Opaque Film
Thickness

Operational

Operational

Macro Inspection

Operational


Operational

Defect Review SEM

March 2013

May 2013

April 2013



19



G450C Operations
-

CNSE Cleanroom

20

11 tools
installed in NY
cleanroom, 3
in progress

Existing
space
allows
for
3
-
4
additional
metrology tools
incoming 2H’12 /
1H’13

20



On Site Equipment Progress
-

Films

PECVD Uniformity example


Thickness
uniformity


SiN
: 5.06
%


1.46 %


Ox:
14.5 %


1.62 %


Throughput


Compatible to 300 mm

Q2,
2012

Q3,
2012

SiN

Ox

5.06
%

1.46
%

14.5
%

1.62
%

21



Wet Clean and Wafer Recycling

Bar brush

Recent optimization

Front side

Back side


Recycled oxide wafer:


Wet Cleaning:

Optimizing early tool

22



On Site Equipment Progress: Defects


P
assed qualification (in July)


Current particle sensitivity 38nm


Continue improving to 30nm











Particle Inspection A: on site

Particle Inspection B: off site


To be moved in soon



Bare Si wafer particle sensitivity

demo
< 30nm


Target sensitivity at ~ 25nm



23



Summary and Opportunities




Test Wafer Operations

Summary


Silicon supply capability improving across the industry




G450C operations have resulted in cleaner wafers


Proven logistics in place, continuous improvement underway


Processed wafer loans increasing


Multiple Wafer Carrier suppliers in place and progressing well


G450C expanding equipment base in existing clean room


Your Opportunities


Leverage G450C Wafer Bank to accelerate your equipment
development


Engage G450C for wafer loan requests via website

http://www.g450c.org/wafer
-
loan.aspx

24





Lithography Update

G450C Lithography Tool Roadmap

2012

2013

2014

2015

2016

2H

1H

2H

1H

2H

1H

2H

1H

2H

Coupon + Imprint

193i patterning access
at
Supplier site

Positive


450mm Imprint + Spacer

300mm Imprint

193i Coupon, EUV Coupon

Potential G450C
tool @ CNSE




Imprint solution before optical lithography available


Imprint + Spacer extends resolution to 14
-
15 nm (2013
-

2014)


Pull in early 193i tool to 2H14


Expect 193i Litho full demo capability 2015
-

2016


Lithography Strategy

Working on an Industry solution to
accelerate 450mm scanner development

28



Imprint as Interim Patterning Measure


450 mm tool is completed, operational by end of 2012


Explore spacer process to extend ~20nm to 10 nm


Litho, Etch, Films engineering team developing templates and
processes to prepare patterned test wafers


Work with Suppliers to build up complete process




Coupons


193i / EUV

Imprint

30nm 1:2

40nm 1:2

29

300mm Nano Imprint Performance

Good CDU, LER;

Profile OK, Rdl ~15nm

SiN

& APF (amorphous carbon) etching



Good CDU, Line edge



Successfully etched
SiN

& APF



Poly Spacer etch on
-
going



Coating at
Supplier site



Solving particle issues


Working on re
-
work issue

450mm Nano Imprint Status



450mm tool is ready in Nov, (Austin)

tuning process




Template design: 22nm ok, verify 14nm capability




Poly spacer for pitch doubling


on going




Negotiate 1
st

phase patterning wafer capacity in Austin








450mm

Demonstration Test Methods
(DTM)




Equipment Performance Metrics (EPM)


“1X nm Range” technology targeted for 2013
-
14 G450C
demonstrations


“ITRS 14 nm Nominal”


Snapshot in continuum of technology progression


Performance of 450 mm and 300 mm tools advances in lock
-
step


Update Process (by end of 2012):


Suppliers propose competitive performance at ‘14 nm” without
revealing sources of guidance or disclosing customer IP


Consortium staff take best Supplier proposals for each tool type to
propose EPMs


Consult with Suppliers for aligned output


Validate EPMs meet Member Companies needs


Implementation


Ensure Demo test plans allow for full range of tool performance


Report the data for each tool with comparison to Demo EPM

34

Updated Equipment Performance Metrics

14nm targets for demo


Agreed with all Suppliers


Publish update by EOY

Millisecond Anneal Example



Demonstration Test Methods
(DTM) Overview

36

37


Equipment Maturity Assessment (EMA) includes a couple of dozen parameters with clear categorization of
the tool characteristics based on defined criteria, as well as compliance with applicable standards; output
is a report recommending pre
-
test actions and testing levels


Test planning is based on the tool maturity, goals for reliability, throughput of the tool and confidence
objectives, combining any Supplier pre
-
data with demo testing via Bayesian statistics


Gauge Studies run for all metrology needed for the demo to ensure adequate Precision/Tolerance ratios


Mechanical Dry Cycle (MDC)
-

nominally 5000 cycles of the wafer movement functions without process for
reliability and mechanical handling defect data


Passive Data Collection (PDC)
-

a test of process stability on a baseline recipe for each application.


Initial data is analyzed and a Baseline Characterization Report issued; decisions are made about
subsequent testing or reversion to tool development to address any hurdles


Sensitivity Analysis
-

DOE optimization of the recipe(s) and RSM characterization of the process window(s)


Marathon
-

24/7 manufacturing simulation to capture tool productivity and reliability performance using
E10 states over a significant period, running process with sample testing to capture rates/variability,
defectivity and tool
-
specific performances like step coverage, gap fill, LER, etc..


A final report is drafted, the Supplier has opportunity for comment, recommendations for tool
improvement are made and demo is completed with web publication

DTM Components

Demonstration Test Methods (DTM)

Duration

2
-
6 months



Demonstration Test Methods (DTM)

Standardized Reports


Executive
Summary

Demo
Test Background


History and previous testing


EMA Report


Test Plan

Test Results


Process Capability
Performance


Gauge study


PDC


Sensitivity Analysis (SA)


Marathon Test


Equipment Performance


MDC


Marathon Test


Others


CoO
,
Standards
compliance, software &
user interface, factory
integration

Conclusions

Supplier Input

38

Compliance with SEMI Standards Required

(www.semi.org)


SEMI E5: SECS II



SEMI E30, E30.1, E30.5: GEM ("Fully GEM Compliant" as well as GEM
Compliant per section 8)



SEMI E37: HSMS




SEMI E37.1: HSMS
-
SS



SEMI E39, E39.1: Object Services Standard: Concepts, Behavior and Services


SEMI E40, E40.1: Standard for Processing Management (PJM)


SEMI E87, E87.1: Specification for Carrier Management (CMS)


SEMI E84, E84.1: Specification for Enhanced Carrier Handoff Parallel I/O
Interface


SEMI E90, E90.1: Specification for Substrate Tracking (STS)


SEMI E94, E94.1: Specification for Control Job Management (CJM) Stream 7
Process Program Management for recipes (E5, E30)


Definition and measurement of equipment reliability, availability, and
maintainability during program testing will conform to SEMI E10
-
0304

39

Self
-
audit completed and findings released (all medium to high risk non
-
conformances are to be addressed):


S2
-
0200: Safety Guidelines for Semiconductor Manufacturing Equipment
including Operational Hazard Analysis covering tool installation, operation and
maintenance (per S2
-
0200) completed for tool install operation / maintenance


S8
-
0308: Safety guidelines for ergonomics engineering of semiconductor
manufacturing equipment


Environmental Characterization Data Summary Work Sheet 6 per International
Semiconductor Manufacturing Initiative (ISMI) guideline #06124825A
-
ENG
completed and provided electronically prior to shipment



100% Compliance to Safety/Ergo Requirements

It is an absolute requirement that all equipment must be safe to operate and
maintain at any stage of maturity


Equipment spare parts and modules must either be small and light enough to
handle safely during maintenance, and clearances adequate, or ergonomic
handling aids must be provided

40

Further Standards
-
related Requirements


Footprint, height and weight dimensions of the Equipment as well as the
move
-
in packages must conform to SEMI E72 specifications


The Equipment loadport must have a RF ID reader compatible with RFID
tags (model numbers TIRIS multipage
MicroTag

RI
-
TRP
-
DR2B) on the FOUP
per SEMI E99


The system must have adequate PGV docking interface exclusion zone per
SEMI E64
-
0600 modified as needed for the SEMI E154 450mm load port


The Equipment configuration must have a minimum of one load port that
confirms to latest revision of SEMI E154



The Equipment load port must be capable of receiving 450mm FOUPs
confirming to SEMI E158.



The Equipment load port must be capable of receiving lots delivered by
450mm Personnel Guided Vehicles (PGVs)

G450C will require SEMI M74 Mechanical Wafer, M76 Developmental Test
Wafer and M1 Prime Wafer Standards and use SEMI
-
compliant carriers for all
program test wafer pool /demo purposes

41

Facilities
-
Related Standards


The Equipment must comply with the current versions of the (U.S.) National Electric
Code
-

NFPA 70 and Uniform Fire Code
-

NFPA 79


The Equipment must be designed to SEMI F47 “Specification for Semiconductor
Processing Equipment Voltage Sag Immunity”


All Equipment and materials which will come into direct contact with the wafer or
FOUP should be grounded per SEMI Spec E78
-
0706.



All Equipment enclosures must have an IEC ingress protection rating of IP31 or
better


SEMI E6
-
1296 facilities interface datasheets completed and provided electronically
prior to shipment


It is recommended that the 450mm Equipment is designed to EU regulatory
requirements including, but not limited to, Machinery Directive 98/37/EC, Pressure
Equipment Directive 97/23/EC, Electromagnetic Compatibility Directive 89/336/EEC,
and Low Voltage Directive 73/23/EEC as applicable





42





Industry Collaboration and
Engagement

Core G450C

Program


Process & Metrology


Wafer Pool


Regional
450mm

Regional Tool Suppliers

not in G450C core program

Tool Suppliers
w/G450C
Demos

Wafer
Suppliers

Guidelines &

Requirements

Global Supply Chain Ecosystem

Example: G450C Linkages

Opportunities

Adjunct
Tool
Demos
and CIP
projects

EEMI
450

+ R&D entities:



FhG



IMEC





KSIA

I450Metro


Component Suppliers


Infrastructure Providers



Standardization Opportunities

Guidelines

Global Standards

Compliance testing

Back End (Die Prep) WG

Standardization WG

Facilities Council

TBD: Harmonize
microcontamination

specs

G450C

Groups

G450C

Program

Activities

Regional Cooperation

Equipment optimization

Facilities optimization

EHS optimization

46

TBD: Metrology collaboration

Discussion this week with ESG
-
J

Precompetitive Cooperation


Identified top facilities project objective with M+W


Identified top standardization focus areas with SEMI


Defined pilot project: tool installation at CNSE with
adaptor plate and consolidated points of connection


F450C membership defined and first meeting with G450C
rolled out project priorities toward proposals


Workshop planned with SEMI, F450C and G450C for early
1Q13 to explore further work


14nm EPM update with standards guidance based on
Supplier tool agreements to be published by end of year

47

Top Areas for Precompetitive Cooperation

with SEMI and F450C (
first targets
)


Top Standardization interest areas


Aisle space / width, ceiling height






General sizing/loading/dimensions


EMO interface, control architecture



Crane, gantry







Templates


Top facilities project interest areas


Gas interface boxes, VMBs, cooling water manifolds, etc.



Minimize facilities POCs







Standard hookups
for power, PCW, CDA, PV, GN2, exhaust,
datacom


Improved AMC detection/response






Pumps and pump frames, etc.


He recycling (Backside cooling ), H2 recycling (EUV)





48

49

TEL Facilities Cost Reductions in Albany

Page
50

G450C



Summary


G450C has launched with full industry
momentum


Significant progress towards the 450 mm
transition is continuing in all areas of the supply
chain


Collaboration and synchronization remain
critical for a cost effective and timely 450 mm
transition

51



Questions and
Discussion



450 mm Reference Materials Location
and Contact Information



Guidelines and other public documents, including Wafer
Loan Program Details, Demonstration Test Methods and
Equipment Performance Metrics can be found at:
http://g450c.org




For further information or to engage in opportunities with
the Global 450 mm Consortium program:


Dave Skilbred

G450C Program Coordination Director

david.skilbred@g450c.org

518.441.7656

53