Procedure Solitec Model 1111 Spray Developer With Microposit 351 Developer

salamiblackElectronics - Devices

Nov 27, 2013 (3 years and 6 months ago)

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Procedure


Solitec Model 1111 Spray Developer

With Microposit 351 Developer

11/28/13

Rev A by John Hudak





Preparation

1.

Make sure DI water is turned on. DI water valves are located in service bay.

2.

Turn on v
acuum pump
.

On/off switch is located on the left side of the tool. Vacuum gauge is
behind the spray heads. Minimum vacuum is
18
in
.

H
g.

3.

Check weight of developer canister. Scale readout is beside the spray heads.
Refill when weight
is less than pounds. Refill with Microposit 351 developer in the ratio of 4 parts DIH
2
O to 1 part
351 developer.

4.

Turn on power switch located on control p
anel

and spinner power switch
.

5.

Check waste developer bucket under cabinet. Empty into positive developer
waste
barrel if full.


Operation

1.

Install the correct size chuck for the substrate being used.

2.

Load substrate and depress
chuck
vacuum switch located
in front of chuck assembly. Orange
light on control panel should go out.

If the orange vacuum light does not go off, make sure
wafer chuck and substrate are properly seated.

3.

DO NOT ADJUST ANY CONTROLS ON CONTROL PANEL.

4.

Depress and
hold

start switch
down

until spray heads drop and spinning begins.

This may take
up to one minute

5.

Lower cover on to spray heads

if necessary
.

6.

First cycle is develop


substrate will spin and develop flow meter ball will rise

7.

Second cycle is rinse, substrate will spin and rinse

flow meter ball will rise

8.

Third cycle is dry


substrate will spin dry, no flow meter flow


Control panel, developer and rinse
water flow meters, and developer
temperature meter

Scale reading


add developer if
weight reads less than 14 pounds

Vacuum pump
power switch

Vacuum gauge

Chuck
vacuum switch

Spinner power switch

Substrate chuck

Procedure


Solitec Model 1111 Spray Developer

With Microposit 351 Developer

11/28/13

Rev A by John Hudak


9.

Allow cycles to complete. Depress stop button to abort cycle if substrates do not spin and call
lab manager.

10.

Raise cover and allow spray heads to rise.

11.

Release
c
huck
vacuum by depressing vacuum button.

12.

Remove substrate.

Shut

Down


1.

Turn off tool power

2.

Turn off vacuum pump


Typical
c
ycle for 6 micron test pattern



1813 photoresist @4000

rpm for 60”



soft bake

on hotplate
@115C f
or

60”



Expose

in HTG mask aligner for
2
2


with intensity of 5
-
10 mW/cm
2
. An exposure dose of about
170 mJ/cm
2



spray
develop for 20” @ 900 rpm



rinse for 45” @ 900 rpm



dry for 45” @ 4000 rpm




Develop spray head


not in use

Develop spray head

Wafer (substrate chuck)


choose correct size for
substrate used