SEMICONDUCTOR News - Canon USA, Inc.

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Nov 1, 2013 (4 years and 11 days ago)

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SEMICONDUCTOR

News
Articles
5510iV Introduction

Rectangular Fly’s Eye Lens /
Ion-Assist i-Line Filter

Canon Americas HQ and
Canon USA News

Dear C
olleagues,


This edition of the Canon SEMICONDUCTOR News introduces Canon’s newest
stepper, the FPA-5510iV. The 5510iV was developed specifically to address the
requirements of semiconductor packaging, 3D chip stacking and fabrication of
Through-Silicon Via (TSV) arrays.

Canon 5X Stepper customers will learn about the benefits of investing in optics
overhauls including application of the Rectangular Fly’s Eye upgrade and long-
life Ion-Assist i-Line Filter option that provide increased system throughput
and imaging control.

Canon SEMICONDUCTOR News also reports on the construction progress at
the new Canon Americas Headquarter in Melville, New York and new products
from Canon Optron and Canon Anelva.

As always, Canon Semiconductor Equipment is interested in hearing your
voice, so please feel free to contact us directly with comments, questions and
requests.

Regards always,
Canon SEMICONDUCTOR News
Semi-Info@CUSA.CANON.com
©
201
2

Canon U.S.A., Inc.
All Rights Reserved

Pg. 2

Pg. 5

Pg. 8

Spring 2012
The new FPA-5510iV stepper provides a large depth
of focus and wide-field exposure for back-end and
advanced packaging customers to support “2.5D” and
“3D” chip stacking process requirements

Canon’s Rectangular Fly’s Eye Lens and Ion-Assist
i-Line Filter provide higher Intensity, throughput
and wider process margin for 5X steppers

Canon Americas Headquarters construction progress
and an introduction to Canon
Anelva and Canon
Optron products


Canon SEMICONDUCTOR News
Spring 2012
2
The FPA-5510iV is Canon’s first
back-end lithography system designed for
advanced packaging applications

Canon FPA-5510iV process features support advanced
packaging and 3D chip stacking

Canon U.S.A., Inc. recently announced its entry into
the semiconductor back-end manufacturing tool market
with the launch of the FPA-5510iV semiconductor
lithography tool for next-generation semiconductor
packaging.

As smart phones, tablet PCs and other electronic
devices become progressively smaller and more
intelligent, the demand for integration and shrinkage of
semiconductor devices continues to increase. One way
to realize such integration is to employ a three-
dimensional layout of chips; layering multiple
semiconductor chips vertically and interconnecting the
chips to configure a single device. To facilitate this
interconnection, the industry has developed Through
Silicon Via (TSV) and Bump processes, enabling
multifold increases of memory capacity, high-speed
data transfer, and reduced electricity consumption in a
smaller layout area.
TSVs are vertical electrical connections that penetrate
through the silicon of a die to allow connection between
the top and bottom surfaces of the chip. Bumps are
conductive solder balls used to bond and interconnect
die to packages, substrates and/or other die.

The launch of the new Canon FPA-5510iV semiconductor lithography tool accommodates the industry’s
TSV and Bump process needs. The stepper utilizes technology cultivated through the company’s best-
selling FPA-5500iZ front-end tool series and marks Canon’s first-ever back-end lithography stepper. The
tool delivers high resolution, high throughput, and high overlay accuracy to meet the rapidly progressing
device demands on performance and integration.















Chip Stacking w/
Wire Bonding 
 

Advanced chip stacking processes employ flip-chip
and Through-Silicon Via technology
Semiconductor Chip
Chip Stacking w/
TSV’s
TSV
1-20m
50-100m
Wire Bond
Bump
(Interconnect/Bond)
Semiconductor
Chip

Canon SEMICONDUCTOR News
Spring 2012
3
New FPA-5510iV systems are designed for TSV and Bump applications
Because the resist film used in the TSV and Bump processes is relatively thick, the FPA-5510iV is equipped
with an optimized Numerical Aperture for patterning features sized from one to several tens of microns,
and small, deep vertical holes in the thick resist.

The New 5510iV Optical System is optimized to support TSV and Bump processes that require resolution
from 1-50 microns with large aspect ratios. The 5510iV Projection Lens NA is variable between 0.10-0.18,
allowing control of the optical system performance including resolution, depth of focus and resist profile.

The 5510iV features large exposure area and
high-intensity optical system to deliver high-
productivity and performance. The 5510iV’s new
2:1 reduction projection lens exposes a wide-field
52x34mm pattern that enables the stepper to
overlay 2 standard, front-end scanner fields in a
single exposure

The 5510iV features a high-efficiency optical
system that utilizes a 4.5kW high-intensity
Mercury lamp as the light source. The FPA-
5510iV also allows the use of i-line light, or a
combination of i-line and h-line light for
exposure. Use of dual-wavelengths can raise
exposure intensity and stepper throughput for the
high-dose, rough bump processes.



The 5510iV alignment system adopts
proven technology from the FPA-5500
platform of steppers and internal
research has shown that the 5510iV
provides superior overlay accuracy
when compared to competitive back-
end exposure systems.
The 5510iV Alignment System
automatically monitors and corrects
for baseline and lens magnification
change due to optics and substrate
heating to provide 300 nanometer
overlay accuracy.

FPA-5510iV Stepper
Optical System
New Projection Lens
Wa
f
er
Stage
Reticle
Mercury
Lamp
Illumination Optical System
Scope
Numerical Aperture
Small  Large
σ (Sigma)
Small  Large
The 5510iV provides variable NA and Sigma settings
allowing profile control through thick resists


Canon SEMICONDUCTOR News
Spring 2012
4
FPA-5510iV options support advanced packaging requirements
The 5510iV also offers an optional Through-Silicon
Alignment (TSA) System to provide backside
alignment capability required for next-generation
packaging and 3D integration. Canon’s TSA
System uses infrared light to penetrate through a
wafer to view and measure alignment marks
buried under silicon or within bonded-wafer stacks.
The 5510iV aligns directly to front-end alignment
marks, eliminating the need to form additional
marks to support backside processing of the wafer.

5510iV Wafer Feeder, Mechanical Prealigner, and
Wafer Chuck options are also available to support
processing of warped wafers that often result from
wafer bonding and thinning operations.
Additional 5510iV options developed for advanced
packaging applications include the non-contact
Wafer Edge Shielding (WES) and Wafer Edge
Exposure (WEE) units and the Resist Exhaust
Outgassing Unit. The WES and WEE allow
negative-tone resist on the wafer perimeter to be
stripped away during development, while the Resist
Exhaust Outgassing Unit protects the projections
lens by continuously removing contaminants
released by thick resists.

Increasing demand for 3-dimensional devices is
affecting market trends for Semiconductor
Lithography Tools It is expected that adoption of 3-
dimensional chip stacking that primarily uses TSV
technology, will continue to grow in the market
areas including high-functioning, cloud computing
products, smart phones, tablet PC’s and MPU’s.
Adoption of 3-D technology in the server memory
market is accelerating.

For more information on the entire suite of Canon
photolithography systems, please visit the
Semiconductor Equipment Division webpage @
www.usa.canon.com/semiconductor_equipment
or email: semi-info@CUSA.Canon.com

Item
FPA-5510iV
NA
0.10-0.18
Sigma
0.40-0.80
Resolution [

m]
≤1.5
Depth of Focus [

m]
≥10
Reduction
1/2
Field Size [mm]
52 x 34
Lamp Power
4.5 kW
Intensity
≥9,000 W/m
2
(i-line)
≥13,000 W/m
2
(i & h-line)
Single Tool Overlay
[nm]
≤300 (front)
≤300 (back, option)
Footprint [WxDxH: m]
2.3 x 3.34 x 2.7
Throughput (WPH)
≥160 (200mm)
≥110 (300mm, 42 shots)
Options
Through-Silicon Alignment
Warped wafer feeder/chuck
Wafer Edge resist removal
Chemical Filte
r
s
Resist Outgassing Unit
PC Remote Control
Online (GEM2, GEM0304)
Pellicle Particle Checke
r
The 5510iV Through-Silicon
Alignment option provides accurate
backside alignment capability

Canon SEMICONDUCTOR News
Spring 2012
5

Canon Optical System Upgrades Improve 3000 Body
Stepper Performance

i-line stepper productivity is a function of many
factors including illumination system efficiency
and exposure light intensity. Canon has
developed an “optics overhaul” package that
introduces the Rectangular Fly’s Eye Lens and
the long-life Ion-Assist i-line Filter to provide
optimized illumination performance and
increased productivity.

FPA-3000i5 steppers feature illumination
systems that are optimized to expose 22x22mm
fields. To provide superior exposure intensity
and uniformity for rectangular field exposure,
Canon has developed the Rectangular Fly’s Eye
Lens unit.

The Fly’s Eye Lens integrates exposure energy
across the face of a reticle, and the area of the
reticle that is illuminated is related to the size and shape of the individual lens element in the Fly’s Eye
unit. The Rectangular Fly’s Eye lens employs small lens elements that are geometrically similar to the
target illumination area on the wafer to improve the overall efficiency of the stepper illumination system.

R
ectangular Fly’s Eye Lens Element size and
shape has been optimized to provide up to 18%
more exposure intensity and 7% more throughput
Optical axis of Fly’s Eye element
Light distribution from Fly’s Eye Element

Fly’s Eye Lens
2
nd


Condenser Lens
Masking
Blade
Mirror

3rd
Condenser Lens
Collimator

Lens

Reticle
σ

Stopper
Illumination Area

Rectangular Fly’s Eye Unit directs and integrates exposure
light across a rectangular Illumination Area on the reticle
Canon SEMICONDUCTOR News
Spring 2012
6

Canon’s Ion
-
Assist i
-
Line Filter provides a stable central wave
length for
exposure light and avoids optical issues caused by filter degradation
Impact of Center Wavelength (
λ
) Shift
NA0.63, σ0.65
350nm pattern
Rectangular Fly’s Eye Lens improvements vary depending on specific illumination modes and exposure
conditions, but sample results have shown intensity improvements averaging 15-18%, yielding
approximately a 5-7% improvement in wafer throughput. Assuming lithography is a bottleneck process,
customers upgrading to the Rectangular Fly’s Eye Lens can expect to recognize their return on investment
within a matter of months.

Canon has also developed the new long-life, Ion-Assist i-line Filter that provides customers with a variety
of advantages including increased productivity, improved CD control and reduced Cost of Ownership.

Canon’s Ion-Assist i-line Filter is manufactured using a deposition process that takes place in an ion-
infused chamber. The high-energy ions improve film surface fluidity during deposition, resulting in a more
uniform and dense filter coating providing durability and reduced moisture absorption.

i-line filters are required by
steppers to reduce the
broadband Mercury lamp
output to a wavelength range
centered at 365nm. By limiting
the exposure wavelength
range, image contrast is
maximized and resolution limits
can be realized.

The Ion-Assist i-line Filter
provides increased wavelength
center-bandwidth control
compared to standard i-line
filters and can improve Depth
of Focus, Field Curvature and a wide variety of optical aberrations. The center-wavelength control of
Canon’s Ion-Assist i-line Filter provides customers with an increased process window for challenging sub-
0.35µm processes that can experience a 20% reduction in DoF when subjected to a 2nm center-
wavelength shift.

Canon internal data has
demonstrated the direct
benefit of the Ion-Assist
Filter with an intensity
improvement of as much as
10% when compared to
earlier i-line filters. This
improvement provides
customers with an
estimated 2 wafers per
hour increase in stepper
throughput.


Center
λ
Shift = 1nm
Center
λ
Shift = 2nm
Depth of Focus
-5%
-20%
Field Curvature
34nm
64nm
Astigmatism
90nm
186nm
L/R Line width diff.
5.5nm
19.4nm
Iso/Dense Bias
6.2nm
33.5nm
Magnification
-0.08ppm
-0.23ppm
3
rd
Order Distortion
3.8nm
9.0nm
Spherical Aberration
-6.7m
λ

-13.2m
λ

Canon’s Ion
-
Assist i
-
Line Filter provides high intensity and stable
center-wavelength to increase stepper throughput and DoF
Unfiltered Mercury Lamp
Output Spectrum
Filtered Spectrum
(365±4nm)
Canon Ion
-
Assist

i-Line Filter
Canon SEMICONDUCTOR News
Spring 2012
7

i
-
Line Filter Cost Analysis

Ion-Assist Payback Period

1 year (based on Unit Cost and Lifetime)
Payback benefit of increased throughput varies according to stepper utilization and wafer value

In addition to providing higher throughput, the Ion-Assist i-line Filter also features a 4-year recommended
lifetime that provides even greater return for our customer. Actual lifetimes may vary according to optical
system condition.

When compared to previous generations of i-line filters offering 1-2 year recommended lifetimes, the new
Ion-Assist i-line Filter represents a clear CoO advantage. Overall, Canon’s development of the Rectangular Fly’s
Eye Lens and Ion-Assist i-line Filter provides our customers with “better than new” optical performance and
throughput for their existing Canon litho equipment.


For more information on these upgrades or any other Canon products, please visit the Semiconductor
Equipment Division webpage @ www.usa.canon.com/semiconductor_equipment
or email:
semi-Info@CUSA.Canon.com
.

Canon Presentations at SPIE Advanced Lithography 2012

Please join these Canon supported papers at SPIE Advanced Lithography 2012 in San Jose, CA.




Unit Cost
(normalized)
Expected Unit
Lifetime
Unit Cost
per year
Throughput
(normalized)
Standard
i-Line Filter
1.0
1 year
1.0
1.0
Ion-Assist
i-Line Filter
1.7
4 years
0.425
1.07
Sub-20nm Logic lithography optimization with simple OPC and multiple pitch division
[8326-39]

Thursday, February 16, 2012 @ 8:00AM

Conference 8326: Optical Lithography XXV & Conference 8327: Design for
Manufacturability through Design-Process Integration IV (Joint Session)

Michael Smayling (Tela Innovations), Koichiro Tsujita, Ryo Nakayama,
Yuichi Goda (Canon)
A study of vertical lithography for high-density 3D structures [8326-50]

Thursday, February 16, 2012 @ 3:30PM

Conference 8326: Optical Lithography XXV

Shin-Ichiro Hirai, Nobuyuki Saito, Yoshio Goto, Hiromi Suda, Ken-Ichiro Mori,
Seiya Miura (Canon):
Canon SEMICONDUCTOR News is a production of the Canon USA Semiconductor Equipment Division ©2012

Executive Publisher: Hiro Haraguchi
Publisher/Editor: Doug Shelton
Semi-Info@CUSA.Canon.com
www.usa.canon.com/semiconductor_equipment


Contributing Writers & Editors: Simon Chan, Phil Barnhart, Jason
Ho, Mike Hugill, David Sheehan, Ken Facklam, Tosh Kudo,
Tomii Kume, Akira Tomita, Takashi Sugimori, Takashi Hanaoka,
Kevin Mattimore, Laura Grant-Swenson, Ann Quigley

Canon SEMICONDUCTOR News
Spring 2012
8

Canon Americas New Headquarters Construction Update
The construction of our new Canon Americas
headquarters in Melville, N.Y. is continuing on
schedule, with the new building planned to open
in the first quarter of 2013. The construction of
this building is a key milestone in Canon
Americas history and we are pleased to be able
to share the progress of our new headquarters
construction with Canon SEMICONDUCTOR News
readers.
Highlights of the One Canon Plaza project include
construction of the Canon lobby, data center,
photo studio, print center, medical lab and
25,000 square foot courtyard.




Canon Americas Headquarters in Melville, New York

is on schedule to open in spring, 2013

CANON USA NEWS


Canon USA, Semiconductor Equipment Division is
now supporting products manufactured by Canon
Anelva Corporation.
Canon Anelva manufactures advanced deposition
equipment used to fabricate semiconductor, hard-
disk drive and flat panel products.
Canon USA provides sales & marketing, engineering,
service and logistics support for Canon Anelva
products to North America based customers.
For more information on all Canon Anelva products
and services, please contact Canon USA via email:
semi-Info@CUSA.Canon.com
Canon Anelva
Co
.

E
C
7800
PVD
Deposition
Tool


CANON
USA NEWS


Canon USA, Semiconductor Equipment Division is
pleased to announce its relationship with our Canon
affiliate company; Canon Optron, Inc.
Canon Optron is a leading provider of Calcium-Fluoride
lenses and anti-fingerprint and anti-reflective coatings.
Canon USA provides sales, engineering and logistics
support for Canon Optron products to customers with
headquarters in North and South America. Canon USA
coordinates with affiliate companies worldwide to support
the global manufacturing requirements of our customers.
For more information on all Canon Optron products and
services, please contact Canon USA via email:
semi-Info@CUSA.Canon.com
Ca
non Optron, Inc.

Ibaraki, Japan