Old Company Name in Catalogs and Other Documents

passengerdewberrySemiconductor

Nov 1, 2013 (3 years and 7 months ago)

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To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April
1st, 2010
April
1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry
1
GET-BE-1002
Ver.5.0: May,2006
NEC Electronics Corporation
Compound Semiconductor Devices Division
Lead (Pb)-free Semiconductor Products
2
GET-BE-1002
Ver.5.0: May,2006


Lead (
Lead (
Pb
Pb
)
)
-
-
free Semiconductor Products of
free Semiconductor Products of
Opto
Opto
-
-
Electronics,
Electronics,
and RF and Microwave Devices
and RF and Microwave Devices
•As a so-called "green vendor", NEC Electronics contributes to global
environmental protection by actively promoting the introduction of Lead
(Pb)-free products as part of our ongoing efforts to develop and supply
environmentally sound products.
•We have completed development of Lead (Pb)-free technology for all of
our opto-electronics, RF, and microwave products*1
and are accepting
orders for Lead (Pb)-free products.
•MoreOver, our future products will all be Lead (Pb)-free.
•In consideration of the environment, we are aiming to completely
eliminate the use of lead*2
in all of our opto-electronics, RF, and
microwave products*1 by the end of September 2006 and have been
progressing with the gradual switchOver*3
since October 2005.
*1:Products made by the former NEC Compound Semiconductor Devices, Ltd.
*2:RoHS compliant (Some products will still have internal parts with material containing lead.) Contact a sales
representative for details.
*3:Except for maintenance products being phased out.
Lead (
Lead (
Pb
Pb
)
)
-
-
free Policies
free Policies
3
GET-BE-1002
Ver.5.0: May,2006
Measures for Lead (Pb)-free Implementation
1. Areas Requiring Lead (Pb)-free
Mount materials such as soldering
paste and soft solder.
(Modules and some power devices)
Solder Plating of Outer Leads
(Plastic packages)
2. Method of Lead (Pb)-free Implementation
*Solder Dip(radialtransistors):
Sn-Ag-Cu Dip
(1) Solder Plating for Outer Leads
(2) Pb reduction inside the packages such as the mount materials
has already met the RoHS Directive requirements. (The complete
Pb free technologies are currently under development. Its actual
implementation date is TBD).
Conventional
Products
Lead (Pb)-free
Products
Sn-PbSn-Bi
AuAu
*
4
GET-BE-1002
Ver.5.0: May,2006
Specification for Lead (Pb)-free
Package
Soldering of Outer Leads
Mount Materials
Pb Usage in Others
SOP Type
DIP Type
MM Type
Power Mold
Ceramic Type
Module Type
(MCM)
(Laser Di)
Sn-Bi Plating
Sn-Bi Plating
Sn-Bi Plating
Sn-Ag-Cu Dip
Au Plating
(Same as at present)
Au Plating
(Same as at present)
Pb Not Used
Pb Not Used
Pb Not Used
Pb Not Used
Complied with the RoHS
Complete Lead (Pb)-free
Implementation underway
(Sn-Pbsoft solder used )
Pb Not Used
Pb Not Used
Pb Not Used
Pb Not Used
Pb Not Used
Radial Type
(Transistor)
Sn-Bi Plating
Pb Not Used
Pb Not Used
QFNType
Sn-Bi Plating
Pb Not Used
Pb Not Used
Soldering of outer leads became Lead (Pb)-free in October, 2001. The Pb contained inside the packages met the
RoHSDirective requirements in December, 2002.
Complied with the RoHS
Complete Lead (Pb)-free
Implementation underway
(Lead glass and Ceramic
Parts, etc.)
Sn-Ag-Cu Paste
5
GET-BE-1002
Ver.5.0: May,2006
Lead (Pb)-free plating comparison (1)
=Why Sn-Bi is the best solution=
Sn-Pb
(Conventional)
Sn-BiSn-CuSn-AgMatte-SnNi/Pd/Au
Composition (wt%)
Melting point (˚C)
Solid-liquid
phase temperature
Alloy
characteristics
Packaging
reliability
Wettability
Soldering
temperature
Joint strength
Productivity
Cost
Notes
Whisker resistance
Surface solder plating
Pb:10
Bi:2
Cu:1.5Ag:3.5Sn:100
-
183-215223-231227-296221(eutectic)232
Soluble plating
x
Cannot be
applied to the
lead frame
containing Fe.
Interferes with
resin adhesion.
ExcellentGoodPoor
x
NG
6
GET-BE-1002
Ver.5.0: May,2006
232
50
→%Sn
100
Sn
Sn
Sn
-
-
Cu
Cu
227
99.3
Liquidus
Liquid


Solid
Temperature→
0
Cu
1083
Solidus
1.5Cu
Lead (Pb)-free plating comparison (2)
=Why Sn-Bi is the best solution=
The solid phase (solidification) temperature of Sn-Bi solder
is influenced by the variation in composition, while the
variation in the liquid phase (melting) temperature remains
small. These characteristics are similar to those of Sn-Pb.
Note: The figures shown are images and may be slightly differentfrom
actual data.
50
→%Sn
100
Sn
0
Pb
327
61.9
183
Sn
Sn
-
-
Pb
Pb
10Pb
Solidus
Liquidus
Liquid


Solid

Semi-solid

50
→%Sn
100
Sn
0
Bi
271
42139
Sn
Sn
-
-
Bi
Bi
2Bi
Liquidus
Solidus
Liquid


Solid

Semi-solid


Semi-solid

221
96.5
960.5
Sn
Sn
-
-
Ag
Ag
50
→%Sn
100
Sn
0
Ag
3.5Ag
Liquidus
Solidus
Liquid


Solid

Semi-solid

7
GET-BE-1002
Ver.5.0: May,2006
Pb
BiSn
Wt%Sn
W
t
%
Sn
Eutectic point:
About 100 degree C
100 80 60 40 20 0
80
60
40
20
100
0
Sn-Bi plating on Sn-PbSolder paste
Sn-Pb-BiMelting Characteristics(image)
Over 200 degree
There are few Bi to Sn, and Pb.
Mounting by Sn-Pbsolder
paste is also possible.
Sn-37Pb paste
(183 degree C : eutectic)
Sn-2Bi plating
(Solid : 223 degree C
-Liquid : 231 degree C)
Low temperature zone
(Under 150 degree C)
Lead (Pb)-free plating comparison (3)
=Why Sn-Bi is the best solution=
Over 200 degree C
Over 200 degree C
Over 175 degree C
8
GET-BE-1002
Ver.5.0: May,2006
Identification of Lead (Pb)-free Products*
Identification by “Marking on the Product”:
Lead (Pb)-free products will be marked with Dot-markor
Alternative markexcept for products using small packages such
as minimoldpackage.
Dot-mark for Product
Identification by “Marking on the Package Label”
Package labels for all Lead (Pb)-free products will be marked with
either “Pb-Free T.”.
Taping reel label will also be markedinthe same manner for
taping at shipment time.
*Note that this marking system applies only to products changed Over to Lead (Pb)-free.
Conventional products not containing Pb will not be marked.
9
GET-BE-1002
Ver.5.0: May,2006
Example Marking
on the Product
Display surface is marked with Dot-mark or underline.
C X X X X
(Ex.) QFN
Example Marking
on the Label
Packing label is
marked with logo.
Lead (
Lead (
Pb
Pb
)
)
-
-
free Products Marking Method
free Products Marking Method
= Compounds / Si Microwave Devices =
= Compounds / Si Microwave Devices =
X X X X
N
(Ex.) 8pSOP
For the details, please contact NEC Electronics Corporation.
*No marking for 175mil 8p SSOP.
Package
Marking on the Label
SOP Type
Dot-mark
Lead (Pb)-free marking (Logo)
on the Label
SSOP Type
Dot-mark
*
(See the examples below.)
QFNType
Underline
DIP Type
Dot-mark
TSSOP/HTSSOP
No Marking
TSON Type
No Marking
Mini Mold Type
No Marking
Power Mold
No Marking
TO-92
No Marking
Marking on the Product
“Pb-Free T.”
*
10
GET-BE-1002
Ver.5.0: May,2006
Lead (Pb)-free Products Marking Method
N E C
2 5 X X
X XXX
DIP (4,6,8PIN)
Specified by the English-letter indicator
in the 2nd digit of the Internal Code.
N E C
2 7 X X
XXXX
l
SOP (4pin:Laser Printing)
Marked with the vertical line
on the bottom-right corner.
1
XXX
SSOP 4PIN
Stamped with Mark.
Example Marking on the Product
=
=
NEPOC Products (
NEPOC Products (
Photocouplers
Photocouplers


OCMOS (OpticalOCMOS (Optical
-
-coupled MOS)) =
coupled MOS)) =
Lead (Pb)-free marking
(Logo) on the inside label
and outside label.
Marking on the ProductMarking on the Label
Internal Code
Laser PrintingVertical Line
Ink Printing
Italicized Product Name
Mark
Laser Printing
Internal Code
Ink PrintingItalicized Product Name
Vertical Line
Flat Lead
SSOP 4PIN
Package
SOP 4PIN
SSOP
16PIN
DIP (4,6,8 PIN)
OC MOS SOP 8PIN
For the details, please contact NEC Electronics Corporation.
Internal Code
“Pb-Free T.”
11
GET-BE-1002
Ver.5.0: May,2006
Recommended Soldering Conditions of Lead (Pb)-free Products
1. Surface Mount Type (SMD)
•IR reflow with the peak temperature 260°C,
•Wave soldering with the molten solder in the 260°C
soldering bath and
•Partial lead heating through the 350°C solder iron tip
can be performed.
2. Through Hole Type (THD)
•Wave soldering with the molten solder in the 260°C
soldering bath and
•Partial lead heating through the 350°C solder iron tip
can be performed.
3. Hand Soldering Type
•Partial lead heating through the 350°C solder iron tip
can be performed.
-Specific conditions apply to some products. Please contact oursales representatives for details. -
12
GET-BE-1002
Ver.5.0: May,2006
•Max. Temperature (Package Surface Temperature): 260°C
•Soldering Time at Max. Temperature : Within 10 seconds
•Soldering Time at Over 220°C: Within 60 seconds
•Preheating Time at 120°C -180°C: 120 ±30 seconds
•Max. number of Reflows: 3 times
•Chlorine Composition of Rosin Flux (%) : 0.2% (wt.) or less
(Heating)
-10s
Time (sec.)
-60s
120 ±30s
(Preheating)
Package Surface Temperature (ºC)
260°C
MAX.
220°C
120°C
180°C
Recommended Soldering Conditions of Lead (Pb)-free Products
(IR Reflow)
-Specific conditions apply to some products. Please contact oursales representatives for details. -
13
GET-BE-1002
Ver.5.0: May,2006
Recommended Soldering Conditions of Lead (Pb)-free Products
(Wave Soldering/Partial Lead Heating)
•Max. Temperature (Molten Solder Temperature): 260°C
•Flow Time: Within 10 seconds
•Preheat Temperature (Package Surface Temperature):Below120°C
•Number of Flows: 1 time
•Chlorine Composition of Rosin Flux: 0.2% (wt.) or less
•Max. Temperature (Outer Lead Temperature): 260°C
•Time (per side of a device* or per lead*): Within 3 seconds
•Chlorine Composition of Rosin Flux:0.2% (wt.) or less
(*:Time is defined per side for SMD and per lead for THD)
Wave Soldering
Partial Lead Heating (Hand Soldering)
-Specific conditions apply to some products. Please contact oursales representatives for details. -
14
GET-BE-1002
Ver.5.0: May,2006
Lead (Pb)-free Product Samples and Mass Production
We are already accepting orders for Lead (Pb)-free optical,
radio-frequency, and microwave products.
Please contact one of our sales representativesfor samples,
products and the delivery date.
Samples for Evaluation are available as below:
Please contact our sales representatives for delivery date.
Package Samples Product Samples
(Part number: (Part number:
Not specified) Specified)
15
GET-BE-1002
Ver.5.0: May,2006
Contact for Inquiries
NEC Electronics Corporation.
Compound Semiconductor Devices Division.
Home Page:
Please visit our web site for information of Compound Semiconductor Devices Division.
URL (Address) http://www.ncsd.necel.com/
Request for Documents/Brochures:
Sales Planning Group of Sales Division or our exclusive distributors
Business Information:
Sales Planning Group of Sales DivisionTel : 044-435-1838
E-mail : csd_salesinfo@ml.necel.com
16
GET-BE-1002
Ver.5.0: May,2006
Reference
17
GET-BE-1002
Ver.5.0: May,2006
Plating Wettability Test Results
= Mini Mold Package =
Test Method:Meniscograph
Standard: ≤3 sec
0
1
2
3
210215220225230235240245250
Zero-cross Time (Sec)
Inner Composition of Evaluated
Plating Solder Material in the Bath
Sn-2.5BiSn-Pb
Sn-2.5BiSn-3Ag-0.5Cu
Sn-PbSn-Pb
Sn-PbSn-3Ag-0.5Cu
Lead (Pb)-free (Sn-Bi) plating
exhibits wettability equivalent to
the current Sn-Pbplating.
Disposal pre-conditions :150deg C HT 48H
Terminal material: Cu
RMA-Type Flux
R-Type Flux
Test Method: Meniscograph
Standard: ≤3 sec
Evaluation Bath Temperature (deg C)
18
GET-BE-1002
Ver.5.0: May,2006
Sn-40PbSn-3Ag-0.5Cu
Mount Solder Paste
Outer Solder Plating
Sn-10Pb
Sn-2.5Bi
Sn-10PbSn-2.5Bi
6pTSMM
(Cu)
6pTUSMM
(Cu)
3pTUSMM
(Cu)
3pL2MM
(Cu)
Vertical
Direction
Vertical
Direction
Vertical
Direction
Vertical
Direction
Horizontal
Direction
Horizontal
Direction
Horizontal
Direction
Horizontal
Direction
37353735
28313233
33314139
13141514
16171920
9999
101113
12
19192118
(unit : N)
Vertical Direction
Horizontal
Direction
Vertical Direction
Horizontal
Direction
Vertical
Direction
Horizontal
Direction
6pTSMM
6pTUSMM3pTUSMM
Vertical
Direction
Horizontal
Direction
3pL2MM
Equivalent Shear Strength of the Mount Solder Paste and the Outer
Solder Plating was Evaluated for Each of 4 Package Types
Mount Condition : One-time IR Reflow (with a peak temperature of 260degC)
Mini Mold Package
Mini Mold Package
Solder Mount Shear Strength Standard: ≥5 N
Lead (Pb)-free Plating Solder Joint Strength Evaluation Results
19
GET-BE-1002
Ver.5.0: May,2006
(unit : N)
Solder Mount Pull Strength: Standard: ≥5 N
All combinations of solder paste and solder plating show
equivalent mount pull strength
Mount Condition : One-time IR Reflow with a peak temperature of 260°C.
Number of samples: 3 packages each.
Sn-40PbSn-3Ag-0.5Cu
Mount Solder Paste
Outer Solder Plating
Sn-10Pb
Sn-2.5Bi
Sn-10PbSn-2.5Bi
4pin DIP
(Cu)
4pin SOP
(42 Alloy)
27282828
>100>100>100>100
4pin SSOP
(42 Alloy)
27282828
Photocouplers
Photocouplers
Solder Joint Strength
20
GET-BE-1002
Ver.5.0: May,2006
Outer Lead Solder
Test Conditions
T
emperature Cycl
e
T
emperature Cycl
e
St
orage a
t
a
Constan
t
St
orage a
t
a
Constant
T
emperature Cycl
e
St
orage a
t
a
Constan
t
(-65to150C)(-65to150C)(85C,85%)(85C,85%)(-65to150C)(85C,85%)
IR

R
e
fl
ow
Not Performed
IR

R
e
fl
ow
Performed
IR

R
e
fl
ow
Not Performed
IR

R
e
fl
ow
Performed
IR

R
e
fl
ow
Not Performed
IR

R
e
fl
ow
Not Performed
L/F* Material
2000 Cycle2000 Cycle2000H2000H2000 Cycle2000H
Cu L/F *
Whi
s
k
er
Not Occurred
Whi
s
k
er
Not Occurred
Whi
s
k
er
Not Occurred
Whi
s
k
er
Not Occurred
Whi
s
k
er
Not Occurred
Whi
s
k
er
Not Occurred
Fe-Ni L/F *
Whi
s
k
er
Not Occurred
Whi
s
k
er
Not Occurred
Whi
s
k
er
Not Occurred
Whi
s
k
er
Not Occurred
--
Fe L/F *
Whi
s
k
er
Not Occurred**
Whi
s
k
er
Not Occurred**
Whi
s
k
er
Not Occurred
Whi
s
k
er
Not Occurred
--
Sn-Bi PlatingSn-Ag-Cu Dip
*L/F=Lead Frame **(-55 to 150 degree C, 1000Cycle)
Judgment : ≤50 um
* No Problems were Observed During Long-Period Storage In Either
Case, Whether Thermal Stress to the Board Mount is Applied or Not
Fe-Ni L/F(225milSOP)
TC2000 Cycle
Cu L/F (Minimold)
TC2000 Cycle
Fe-Ni L/F (225milSOP)
HHT2000H
*
Cu L/F (Minimold)
HHT2000H
*
*:Rough surface is caused by metal rusts.
Lead (Pb)-free Plating Whisker Test Results
C
h
e
c
k
SEM:IR Reflow Not Performed
21
GET-BE-1002
Ver.5.0: May,2006
*L/F=Lead Frame
Judgment : ≤40 um (complied iNEMI)
Outer Lead Solder
Test Conditions
Temperature Cycle
Storage at a Constant Temperature & Humidity
IR Reflow Not Performed
L/F* Material
1000Cycle
3000H
Cu L/F*
Whisker
Not Occurred
Fe-Ni L/F*
Fe L/F*
Sn-BiPlating
C
h
eck
Results of Whisker Test (complied JEDEC standard)
(-40 to 85 degree C)
(60 degree C,90%)
IR Reflow Not Performed
Whisker
Not Occurred
Whisker
Not Occurred
Whisker
Not Occurred
Whisker
Not Occurred
Whisker
Not Occurred
* No Problems were Observed in JEDEC standerdcondition too.