July 2008 Florida Department of Education CURRICULUM FRAMEWORK Program Title:

jadesoreAI and Robotics

Nov 13, 2013 (3 years and 9 months ago)

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July
2008



Florida Department of Education

CURRICULUM FRAMEWORK



Program Title:


Micro Electronics Manufacturing Technology

Occupational Area:


Industrial

Education

Career Cluster:


Manufacturing










PSV

CIP Number
:



1615030303 AS





0
615030303

AAS

Grade Level
:



College Credits

Length
:




68

Credits



I.
MAJOR CONCEPTS/CONTENT
:
The purpose of this program is to prepare

students for employment as Microelectronic Manufacturing Process

Technologists. This program also provides supplementa
l training for

persons previously or currently employed in this occupation.

This program includes selected competencies from the common core

electronics program.

The content includes, but is not limited to the following: statistical

process control, direc
t current (DC) circuits, alternating (AC)

circuits, analog, solid
-
state
and digital devices, use of circuit

diagrams and schematics, high reliability soldering,
laboratory

practices; clean room contamination control, computer literacy, human

relations, emp
loyability skills, work safety practices and ethics.

This program focuses on
broad, transferable skills and stresses

understanding and demonstration of the following
elements of the

Microelectronics Manufacturing Technology industry; planning,

management,

finance, technical and product skills, underlying

principles of technology, labor issues, community issues and health,

safety, and environmental issues.


II.
LABORATORY ACTIVITIES
:
Shop or laboratory activities are an integral

part of
this program. These
activities provide instruction in the use

of tools, test equipment,
materials and processes found in the

semiconductor manufacturing industry. Students will troubleshoot,

reassemble and calibrate precision equipment used in the

microelectronic manufacturin
g
process.


III.
SPECIAL NOTE
:
SkillsUSA
, Inc., is an

appropriate
career and technical

student
organization for providing leadership

training experiences and reinforcing specific
career
and technical

skills.
T
hese activities are considered an integral part

of

instructional
program.


The cooperative method of instruction may be utilized for this program.

Whenever the cooperative method is offered, the following is required

for each student: a training agreement, a training plan signed by the

student, teacher

and employer, including instructional objectives and a

list of on
-
the
-
job learning experiences and a work station which

reflects equipment, skills and tasks which are relevant to the

occupation which the student has chosen as a career goal. The student

mu
st be paid for work performed.


The standard credit hour length for this program is 68 according to SBR

6A
-
14.030.


IV.
INTENDED OUTCOMES
:
After successfully completing this program, the


student will be able to:


01.0 Demonstrate technical communication
skills

02.0 Demonstrate basic mathematics skills

03.0 Use basic computer systems and applications

04.0 Demonstrate a basic understanding of DC electronics and

e
lectronics components

05.0 Demonstrate a basic understanding and applications of

i
nstrumentation

and controls

06.0 Follow safe clean room practices and policies.

07.0 Demonstrate an understanding of metrology testing and

applications

08.0 Demonstrate a basic understanding of vacuum and pneumatic

systems and their
applications

09.0 Demonstrate a basic

understanding of robotic systems and their

applications

10.0 Demonstrate an understanding of microelectonic manufacturing

processes

11.0 Demonstrate a basic understanding of quality concepts and

systems

12.0 Demonstrate a basic knowledge of chemistry and
physics concepts

13.0 Demonstrate an understanding of statistical process control

14.0 Demonstrate an understanding of material handling and delivery











July
2008



Florida Department of Education

STUDENT PERFORMANCE STANDARDS



Program Title:
Micr
o Electronics Manufacturing Technology



01.0
DEMONSTRATE TECHNICAL
COMMUNICATION

SKILLS
--
The student
will be

able to:


01.01 Perform pass down communications.

01.02 Write technical reports.

01.03 Demonstrate proper logbook recordings.

01.04 Illustrate rep
orts with graphs, diagrams and charts.

01.05 Demonstrate training communication skills.

01.06 Deliver oral reports to groups.

01.07 Read and follow flow charts.


02.0
DEMONSTRATE BASIC MATHEMATICS
SKILLS
-
The student will be able
to:


02.01 Solve problems f
or volume, weight, area, circumference and


perimeter
measurements for common shapes

02.02 Measure tolerances on horizontal and vertical surfaces in any


units

02.03 Add, subtract, multiply and divide with fractions, decimals,


and integers.

02.04 Solve si
multaneous equations.

02.05 Solve quadratic equations.

02.06 Plot linear equations.

02.07 Perform straight line least squares fit.

02.08 Solve simple trigonometric equations.

02.09 Perform conversions between English and metric units of length,


area, and
volume.

02.10 Perform logarithmic calculations.

02.11 Plot logarithmic functions.


03.0
USE BASIC COMPUTER SYSTEMS AND
APPLICATIONS
-
The student will be

able to:



03.01. Demonstrate an understanding of a LAN (local area network)

03.02. Use windows based o
perating system

03.03. Demonstrate an understanding of file structures

03.04. Use word processing software to format and generate reports

03.05. Use spreadsheets to perform calculations, plot graphs, and



analyze data

03.06. Send, retrieve and maintain el
ectronic mail

03.07. Demonstrate an understanding of computer logic including



flowcharting, digital components


04.0
DEMONSTRATE A BASIC UNDERSTANDING OF DC ELECTRONICS
AND ELECTRONIC

COMPONENTS
-
The student will be able to:


04.01 Demonstrate an understa
nding of how and where solid state


devices (transistors, diodes, silicon control rectifiers (SCR),


logic devices, and electronic relays are used

04.02 Identify the electronic components of a power supply circuit


including capacitors, inductors, and tran
sformers

04.03 Perform calculations on series and parallel circuits.

04.04 Use chart recorders, oscilloscopes, voltmeters, ammeters, and


ohm meters to perform maintenance on equipment and to trouble


shoot equipment problems.

04.05 Demonstrate an understa
nding of single and multiphase motors.

04.06 Understand a voltage divide circuit.


05.0
DEMONSTRATE A BASIC UNDERSTANDING AND APPLICATIONS OF
INSTRUMENTAL

AND

CONTROLS
-
The student will be able to:


05.01 Describe the principles of operation of mass flow co
ntrollers,


temperature controllers, throttle valve, upstream and


downstream pressure control.

05.02 Describe how different temperature sensors detect


(thermocouple, pyrometer)

05.03 Identify the role of PLC

05.04 Identify the components of PLC

05.05 Kno
w typical input and output power requirements of control


devices and how they interface with PLC.

05.06 Read pin
-
out diagram.

05.07 Convert analog signal to appropriate units.

05.08 Identify common error types and instrument limitations.

05.09 Identify in
situ monitoring techniques (optical emission,


reflectance, deposition monitor, RGA)

05.10 Understand the concept behind PID control

05.11 Understand the need for measuring standards.

05.12 Perform a calibration on control instruments.




06.0
FOLLOW SAFE
CLEAN ROOM PRACTICES AND POLICES

-
The student
will be

able

to:


06.01 Demonstrate proper gowning and degowning routines.

06.02 Identify different types of personal protection equipment,


requirements, and where used.

06.03 Know the lock out tag out regulat
ions.

06.04 Know how to read MSDS sheets and where to find necessary


information (IDLH, TLV, compatibility, etc)

06.05 Know different types of warning and safety signs

06.06 Know the use of emergency power shut off buttons

06.07 Know the hazards associate
d with the use of lasers, radiations


sources, rf generators, wet chemicals, compressed gas cylinders


and high voltage sources

06.08 Demonstrate safe use and appropriate house keeping of hand and


power tools

(heat guns, drummel tools, hand drill, solderi
ng

guns, etc)

06.09 Demonstrate proper wafer handling techniques

06.10 Demonstrate the need for contamination control.


07.0
DEMONSTRATE AN UNDERSTANDING OF METROLOGY TESTING
AND APPLICATIONS

The

student will be able to:


07.01 Know and identify common wa
fer defects

07.02 Demonstrate an understanding of how the following metrology


tools work and the data that they provide:

07.02.1 SEM (scanning electron scope)

07.02.2 X
-
ray diffractions

07.02.3 POLARON (capacitance voltage measurement)

07.02.4 4
-
point pro
be

07.02.5 Hall effect

07.02.6 R.P.L. (Rapid Photo Luminescence)

07.02.7 FTIR(Fourier Transform Infra Red spec)

07.02.8 Ellipsometer

07.02.9 Laser surface profile

07.02.10 Visual image comparison

07.02.11
P
rofilometer

07.02.12 atomic force microscope


08.0

DEMONSTRATE AN UNDERSTANDING OF VACUUM AND PNEUMATIC
SYSTEMS AND

THEIR

APPLICATIONS
--
The student will be able to:


08.01 Identify and describe pressure gauges and how they work, where


used and (baratron, thermocouple, pirani, cold cathode,


piezoelectric
) principles of operation and ranges of use.

08.02 Identify and describe vacuum pumps and how they work, where


used and (baratron, thermocouple, pirani, cold cathode,


piezoelectric)

08.03 Identify types of vacuums pumps (turbo, cryo, mechanical,


rotary
vane, dry sroll) and applications.

08.04 Demonstrate use of a leak detector and techniques for use

08.05 Define crossover pressure and why it is important

08.06 Verify calibration of gauge

08.07 Perform routine maintenance on pumps

08.08 Understand the con
cept of virtual leaks and techniques to


minimize

08.09 Understand the concept of back streaming and how to minimize

08.10 Identify welds and joints (VCR, quick flange, VCO, ISO,


conflat, compression fittings, ultratorr)

08.11 Identify valve types (bellow
s, diaphragm, gates, isolation,


ball), their applications for use, modes of failure, and how


they are used.


09.0
DEMONSTRATE A BASIC UNDERSTANDING OF ROBOTIC SYSTEMS
AND THEIR

APPLICATIONS
-
-
The student will be able to:


09.01 Understand the operation of

a stepper motor, servo motor, and


encoders

09.02 Calibrate position and timing

09.03 Identify types of feed
-
through mechanisms

09.04 Identify types of robotic sensors (optical, mechanical, time)


and how to use (home, limit, pressure, etc)

09.05 Program
a simple robot movement


10.0
DEMONSTRATE AN UNDERSTANDING OF MICROELECTRONIC
MANUFACTURING

PROCESS

The

student will be able to:


10.01 Demonstrate an understanding of the following wafer


manufacturing processes:

10.01.1. plasma etch (ECR, HDP, RIE)

10.01
.2. photolithography

10.01.3. thermal processing (diffusion, oxidation, RTA)

10.01.4. deposition (APCVD, LPCVD, PECVD, PVD)

10.01.5. crystal growth (MOCVD, LPE, MBE)

10.01.6. wet processing

10.01.7. implant

10.01.8. polishing (CMP)

10.02 Create a process f
low for a simple device


11.0
DEMONSTRATE A BASIC UNDERSTANDING OF QUALITY CONCEPTS
AND SYSTEMS
-
-
The

student will be able to:



11.01 Demonstrate a basic understanding of the role of quality


systems in industry

11.02 Demonstrate a basic understanding of t
he quality implementation


processes and procedures

11.03 Demonstrate teamwork skills including: active listening,


leadership skills, team member skills, valuing team members’


inputs, recognition of barriers, sharing duties and


responsibilities

11.04 Us
e a problem solving methodology to solve quality improvement


(QI) issues

11.05 Understand the importance of teamwork in different workplace


settings


12.0
DEMONSTRATE A BASIC KNOWLEDGE OF CHEMISTRY AND
PHYSICS

CONCEPTS
-
The

student will be able to:


12.01

Identify chemical elements from their symbols and placement on


periodic table

12.02 Describe the basic atomic structure of specific elements

12.03 Describe the three basic states of matter

12.04 Identify the basic properties of acids, bases, and salts

12
.05 Identify the basic characteristics of ionic and covalent bonds

12.06 Read and interpret simple chemical reactions

12.07 Perform gas law calculations

12.08 Describe a mole.

12.09 Solve simple work and energy problems

12.10 Solve simple force and pressur
e problems

12.11 Describe magnetism

12.12 Describe waves and identify their properties

12.13 Describe basic optical components and how they work

12.14 Solve simple ohm’s law circuit problems.



13.0
DEMONSTRATE AN UNDERSTANDING OF STATISTICAL PROCESS
CONTR
OL
-
The student

will be able to:


13.01 Define basic statistical parameters including mean, mode,


median, standard deviation, etc)

13.02 Identify different distributions patterns including normal and


skewed distributions

13.03 Read and interpret histogram
s, scatter plots, xbar
-
range, and


control charts

13.04 Define control limits and specs limits

13.05 Know why industry uses SPC

13.06 Define the term process capability



14.0
DEMONSTRATE AN UNDERSTANDING OF MATERIAL HANDLING
AND DELIVERY
--
The

student will

be able to:


14.01 Identify the components of a gas delivery systems (cylinders,


valves, cabinets, valve manifold box, coax tubing, gas


detection sensors, regulators, integrated engineering control


for facility

14.02 Describe how flow balance systems w
ork including vent run


balance, dilution network

14.03 Know cylinder change out procedures (cycle purges, venturi,


gasket compatibility)

14.04 Know the importance of component material compatibility system

14.05 Know how liquid sources are delivered to p
rocesses (hazards,


temperature dependence)

14.06 Identify components of bulk liquid delivery systems to


processes (pressurized or pumped delivery, bleedlines, liquid


and vapor sensor)

14.07 Identify different types of scrubbing methods (chemical,


charc
oal absorption, burnt boxes, water base scrubber) and


their applications.