Thermal Issues References

gilamonsterbirdsElectronics - Devices

Nov 24, 2013 (4 years and 1 month ago)

82 views

© Mircea Stan, Kevin Skadron, David Brooks, 2002

1

Thermal Issues References


“Thermal considerations in cooling large scale high
compute density data centers”
Patel, C.D.; Sharma, R.;
Bash, C.E.; Beitelmal, A.

Termal and Thermomechanical
Phenomena in Electronic Systems, 2002. ITHERM 2002. The
Eighth Intersociety Conference on , 2002, Page(s): 767
-
776


“A system design approach to liquid
-
cooled
microprocessors”,
Dickinson, R.D.; Novotny, S.; Vogel, M.;
Dunn, J.

Thermal and Thermomechanical Phenomena in
Electronic Systems, 2002. ITHERM 2002. The Eighth
Intersociety Conference on , 2002, Page(s): 413
-
420


“Packaging the Itanium microprocessor”
Hong Xie; Watwe,
A.; Yusuf, I.; Cherukuri, N.; Brandenburger, P.; Kay, A.;
Chandran, B.

Electronic Components and Technology
Conference, 2002. Proceedings. 52nd , 2002, Page(s): 583

589


“High performance package designs for a 1 GHz
microprocessor “,
Hasan, A.; Sarangi, A.; Baldwin, C.S.;
Sankman, R.L.; Taylor, G.F.

Advanced Packaging, IEEE
Transactions on, Volume: 24 Issue: 2 , Nov. 2001, Page(s):
470
-
476

© Mircea Stan, Kevin Skadron, David Brooks, 2002

2

Thermal Issues References


“The IA
-
64 Itanium processor cartridge”,
Samaras, W.A.;
Cherukuri, N.; Venkataraman, S.

IEEE Micro , Volume: 21
Issue: 1 , Jan.
-
Feb. 2001, Page(s): 82
-
89


“Novel thermal validation metrology based on non
-
uniform
power distribution for Pentium(R) III Xeon cartridge
processor design with integrated level two cache”
Teck
Joo Goh; Amir, A.N.; Chia
-
Pin Chiu; Torresola, J.

Electronic
Components and Technology Conference, 2001
Proceedings., 51st , 2001, Page(s): 1181
-
1186


“An accelerated reliability test method to predict thermal
grease pump
-
out in flip
-
chip applications”
Chia
-
Pin Chiu;
Biju Chandran; Mello, K.; Kelley, K.

Electronic Components
and Technology Conference, 2001. Proceedings., 51st ,
2001, Page(s): 91
-
97


“Characterization of laminar jet impingement cooling in
portable computer application”
Guarino, J.R.; Manno, V.P.


Semiconductor Thermal Measurement and Management,
2001. Seventeenth Annual IEEE Symposium , 2001 Page(s):
1
-
11





© Mircea Stan, Kevin Skadron, David Brooks, 2002

3

Thermal Issues References


“Study of heatsink grounding schemes for GHz microprocessors”
Radhakrishnan, K.; Wittwer, D.; Yuan
-
Liang Li

Electrical
Performance of Electronic Packaging, 2000, IEEE Conference on.
, 2000 Page(s): 189
-
192


“Reliability of commercial plastic encapsulated microelectronics
at temperatures from 125C to 300C”
McCluskey, P.; Mensah, K.;
O'Connor, C.; Lilie, F.; Gallo, A.; Fink, J.

Aerospace Conference
Proceedings, 2000 IEEE , Volume: 5 , 2000 Page(s): 445
-
450 vol.5


“Packaging technology for high performance CMOS server Fujitsu
GS8900”
Fujisaki, A.; Suzuki, M.; Yamamoto, H.

Electronic
Components & Technology Conference, 2000. 2000 Proceedings.
50th , 2000 Page(s): 920
-
924


“High performance package designs for a 1 GHz microprocessor”

Hasan, A.; Sarangi, A.; Baldwin, C.S.; Sankman, R.L.; Taylor, G.F.


Electronic Components & Technology Conference, 2000. 2000
Proceedings. 50th , 2000 Page(s): 1178
-
1184


“Application of phase
-
change materials in Pentium (R) III and
Pentium (R) III Xeon processor cartridges”
Chia
-
Pin Chiu;
Solbrekken, G.L.; LeBonheur, V.; Xu, Y.E.

Advanced Packaging
Materials: Processes, Properties andInterfaces, 2000.
Proceedings. International Symposium on , 2000 Page(s): 265
-
270

© Mircea Stan, Kevin Skadron, David Brooks, 2002

4

Thermal Issues references


“Cartridge thermal design of Pentium/sup (R)/ III processor for
workstation: giga hertz technology envelope extension
challenges”
Teck Joo Goh; Amir, A.N.; Chia
-
Pin Chiu; Torresola,
J.

Electronics Packaging Technology Conference, 2000. (EPTC
2000). Proceedings of 3rd , 2000 Page(s): 65
-
71


“Integrated heat sink
-
heat pipe thermal cooling device”
Yusuf, I.;
Watwe, A.; Ekhlassi, H.

Thermal and Thermomechanical
Phenomena in Electronic Systems, 2000. ITHERM 2000. The
Seventh Intersociety Conference on , 2000 Page(s): 27
-
30 vol. 2


“Refrigeration technologies for sub
-
ambient temperature
operation of computing systems”

Ghoshal, U.; Schmidt, R.

Solid
-
State Circuits Conference, 2000.
Digest of Technical Papers. ISSCC. 2000 IEEE International , 2000
Page(s): 216
-
217, 458


“Low temperature CMOS experience at IBM”
Schmidt, R.

Semiconductor Thermal Measurement and Management
Symposium, 2000. Sixteenth Annual IEEE , 2000 Page(s): 112
-
113


“Heat spreader attach: a microprocessor thermal solution”
Starr,
O.; Master, R.N.; Khan, M.Z.; Tain, A.; Ding, D.H.; Juwanda, A.

Electronic Components and Technology Conference, 1999. 1999
Proceedings. 49th , 1999 Page(s): 238
-
242

© Mircea Stan, Kevin Skadron, David Brooks, 2002

5

Thermal Issues references


“The development of component
-
level thermal compact
models: the Motorola PowerPC 603 and PowerPC 604
RISC microprocessors”
Parry, J.; Rosten, H.; Kromann,
G.B.

Components, Packaging, and Manufacturing
Technology, Part A, IEEE Transactions on, Volume: 21
Issue: 1 , March 1998 Page(s): 104
-
112



Influence of Temperature on Microelectronics and
System Reliability: A Physics of Failure Approach
” ISBN:
0849394503, 1997 Pradeep Lall; Michael Pecht; Edward B
Hakim



Temperature Measurement
” ISBN: 080198385 1993Bela
G Lintak



Air Cooling Technology for Electronic Equipment
” ISBN:
0849394473 1996 Sung Jin Kim; Sang Woo Lee“
The
Electronic Packaging Handbook
” ISBN: 0849385919 1999
Glenn R Blackwell



Thermal Design of Electronic Equipment
” ISBN:
0849300827 2000 Ralph Remsburg



Thermal Measurements in Electronics Cooling
” ISBN:
0849332796 1997 Kaveh Azar



© Mircea Stan, Kevin Skadron, David Brooks, 2002

6

TEC references


D
.
M
.

Rowe
.

“CRC

Handbook

of

Thermoelectronics”

CRC

Press,

1995
.


B
.
J
.

Huang

et

al
.

“A

design

method

of

thermoelectric

cooler”

International

Journal

of

Refrigeration
,

2000
.



J
.
A
.

Chavez

et

al
.

“SPICE

Model

of

Thermoelectric

Elements

Including

Thermal

Effects”

IEEE,

2000
.



Piotr

Dziurdzia

and

Andrzej

Kos
.

“Tool

for

Fast

Modeling

Active

Heat

Sink”,

Seventeenth

SEMI
-
THERM

Symposium
,

2001
.



Piotr

Dziurdzia

and

Andrzej

Kos
.

“High

Efficiency

Active

Cooling

Systems”,

Sixteenth

SEMI
-
THERM

Symposium
,

2000
.


© Mircea Stan, Kevin Skadron, David Brooks, 2002

7

Power modeling references


Brooks, et al. “Wattch: a framework for architectural
-
level power
analysis and optimizations” Proceedings of the 27th International
Symposium on Computer Architecture, June, 2000


Brooks, D, et al. “New methodology for early
-
stage,
microarchitecture
-
level power
-
performance analysis of
microprocessors, IBM Journal of R&D, Vol 47, No. 5/6, 2003.


Gunther, et al. “Managing the Impact of Increasing
Microprocessor Power Consumption,” Intel Technology Journal,
Q1, 2001


Ponomarev, et al. , “AccuPower: An Accurate Power Estimation
Tool for Superscalar Microprocessors"”, DATE'02, March 2002.


Ye, et al., “The Design and Use of SimplePower: A Cycle
-
Accurate
Energy Estimation Tool,” DAC2000.


Dhodapkar, et al., “TEMPEST: A thermal enabled multi
-
model
power/performance estimator,” In Proceedings of the Workshop
on Power
-
Aware Computer Systems, 2000.

© Mircea Stan, Kevin Skadron, David Brooks, 2002

8

Thermal management references


“A thermal
-
aware superscalar microprocessor”
Chee How
Lim; Daasch, W.R.; Cai, G.

Quality Electronic Design,
2002. Proceedings. International Symposium on , 2002

Page(s): 517
-
522


Kevin

Skadron

et

al
.

“Control
-
Theoretic

Techniques

and

Thermal
-
RC

Modeling

for

Accurate

and

Localized

Dynamic

Thermal

Management”

Proceedings

of

the

Eighth

International

Symposium

on

High
-
Performance

Computer

Architecture
,

Feb
.

2
-
6
,

2002
.





“Dynamic thermal management for high
-
performance
microprocessors”
Brooks, D.; Martonosi, M.

High
-
Performance Computer Architecture, 2001. HPCA. The
Seventh International Symposium on , 2001 Page(s): 171
-
182



© Mircea Stan, Kevin Skadron, David Brooks, 2002

9

Clustering References


R.I. Bahar S. Manne, “Power and Energy Reduction Via Pipeline
Balancing” in Proceedings. 28th Annual International Symposium
on Computer Architecture, 2001


A. Baniasadi, and A. Moshovos, “Instruction Distribution
Heuristics for Quad
-
Cluster, Dynamically
-
Scheduled, Superscalar
Processors”, Proc. 33rd. Int’l. Symp. on Microarchitecture
(MICRO
-
33)


R. Canal, J.M. Parcerisa, A. Gonzalez.
“A Cost
-
Effective Clustered
Architecture”. In Proc. of the Int. Conf. on Parallel Architectures
and Compilation
Techniques, 1999


R. Canal, J.M. Parcerisa, A. González “Dynamic Cluster
Assignment Mechanisms” in Proc. of the Sixth International
Symposium on High
-
Performance Computer Architecture, 2000.
HPCA
-
6)


P. Chaparro, J. González, A. González “Thermal
-
Effective
Clustered Microarchitectures” First Workshop on Thermal Aware
Computer Systems (TACS
-
2004), 2004


K.I. Farkas, P. Chow, N.P. Jouppi, Z. Vranesic, “The Multicluster
Architecture: Reducing Cycle Time Through Partitioning”, in Proc.
of the 30th. Ann. Symp. on Microarchitecture, December
1997,
pp149
-
159


© Mircea Stan, Kevin Skadron, David Brooks, 2002

10

Clustering References


J. González, A. González “Dynamic Cluster Resizing” Computer
Design, 2003. Proceedings. 21st International Conference on
,

ICCD 03


J. González, F. Latorre, A. González “Cache Organizations for
Clustered Microarchitectures” 3rd Workshop on Memory
Performance Issues (WMPI
-
2004), 2004


S. Heo, K. Barr, K. Asanovic “Reducing Power Density Through
Activity Migration” Proceedings of the 2003 International
Symposium on Low Power Electronics and Design, 2003 (ISLPED
'03)


G.A. Kemp, M. Franklin, “PEWs: A Decentralized Dynamic
Scheduler for ILP Processing”, in Proc. of the Int. Conf. on
Parallel Processing. 1996, v.1, pp 239
-
246


S. Palacharla, N.P. Jouppi, and J.E. Smith, “Complexity
-
Effective
Superscalar Processors”, in Proc of the 24th. Int. Symp. on Comp.
Architecture, 1997, pp 1
-
13


J.M. Parcerisa, A. González, J.E. Smith, “A Clustered Front
-
End
for Superscalar Processors

“ Technical Report UPC
-
DAC
-
2002
-
29,
2002


J.M. Parcerisa, J. Sahuquillo, A. González, J. Duato “Efficient
Interconnects for Clustered Microarchitectures”, Proc. of the
International Conference on Parallel Architectures and
Compilation Techniques, 2002.


© Mircea Stan, Kevin Skadron, David Brooks, 2002

11

Clustering References


S.S. Sastry, S. Palacharla, J.E. Smith, “Exploiting Idle Floating
-
Point Resources For Integer Execution”, in Proc. of the Int .Conf.
on Programming Lang. Design and Implementation. Montreal,
1998.


V.V. Zyuban, Kogge, P. M. “Inherently Lower
-
Power High
-
Performance Superscalar Architectures”, IEEE Transactions on
Computers 2001


© Mircea Stan, Kevin Skadron, David Brooks, 2002

12

Power Distribution References


D.J. Herrell and B. Beker. “Modeling of power distribution
systems for high
-
performance microprocessors,” IEEE
Transactions on Advanced Packaging, vol. 22, no. 3, pp. 240
-
248,
Aug. 1999.


M.D. Pant, P. Pant, D.S. Wills, V. Tiwari. “Inductive Noise
reduction at the architectural level,” Proceedings of the 13th
Int'l Conference on VLSI Design, Jan. 2000.


E. Grochowski, D. Ayers, and V. Tiwari. “Microarchitectural
simulation and control of di/dt
-
induced power supply voltage
variation,” HPCA8, Feb. 2002.


R. Joseph, D. Brooks, M. Martonosi. “Control techniques to
EliminateVoltage Emergencies in High Performance Processors,”
HPCA9, Feb. 2003.


M. Powell and T. N. Vijaykumar, “Pipeline Damping: A
Microarchitectural Technique to Reduce Inductive Noise in
Supply Voltage”, ISCA30, June 2003


R. Joseph, Z. Hu, and M. Martonosi, "Wavelet Analysis for
Microprocessor Design: Experiences with Wavelet
-
Based dI/dt
Characterization" HPCA, February 2004.


M. Powell and T. N. Vijaykumar. “Exploiting Resonant Behavior to
Reduce Inductive Noise,” ISCA2004.


K. Hazelwood and D. Brooks. “Eliminating Voltage Emergencies
via Microarchitectural Voltage Control Feedback and Dynamic
Optimization ,” ISLPED2004.