Smart Integrated Systems

bijoufriesAI and Robotics

Oct 19, 2013 (3 years and 10 months ago)

97 views

© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de


Hubert Lakner
1
, Joachim Pelka
2


Smart Integrated Systems




A new chance for “Made in Europe”

1
Fraunhofer Institute for Photonic Microsystems IPMS, Maria
-
Reiche
-
Str. 2, 01109 Dresden, Germany

2
Fraunhofer Group for Microelectronics, Anna
-
Louisa
-
Karsch
-
Str. 2, 10178 Berlin, Germany


© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de


Contents


The Fraunhofer Microelectronics Group


Microelectronics 2012


the Environment


From Technology towards solutions for Grand Challenges


Example Automotive


Example Human Machine Interaction


Europe 2020


Technologies for Global Challenges


Concluding Remarks



© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

Fraunhofer Microelectronics

Mission


Fraunhofer Microelectronics is an internationally leading research and
technology organization in the field of
Smart Systems
.


Fraunhofer Microelectronics performs research and development with a focus
on the
key enabling technology micro
-
/nanoelectronics
.


Fraunhofer Microelectronics supports the German and European industry
along the whole
value chain from basic technologies to final products
.


Fraunhofer Microelectronics is
strengthening the competitive position of
its customers.


Fraunhofer Microelectronics meets the challenges of innovative key
technologies with an
industry
-
like professional working environment
and
outstanding equipment.


© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

Fraunhofer Group for Microelectronics in a Nutshell


13 Institutes, 3 Guests




305 m Budget (2011)




255 m Revenues




139 m (46%) from Industrial
Contracts


Appr. 2,900 Employees



Patents applied


199


Patents granted


56


Patents total



7779



More than 350 Customers




Ilmenau



Chemnitz



Dresden



Itzehoe



Duisburg



Erlangen/Nürnberg



München





Berlin



Freiburg



Paderborn



Freiberg



Wachtberg


Close cooperation with CEA, IMEC, VTT, CSEM, TNO, …

© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

Customer Base

The biggest customers 2011

© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

Microelectronics 2012
-

the Environment


Three major industrial priorities in Europe
*)


Strengthening of Europe’s microelectronics
Manufacturing

units


Further development of

Functional Diversification


Support for European
E&M suppliers
during early positioning in emerging
markets


Europe’s R&D has a strong focus on the area of
Functional Diversification
.


Functional Diversification
is key to
Smart Integrated Systems,
a strength in
European semiconductor manufacturing


Smart Integrated Systems
are the basis of future and sustainable success for
European industries like civil & medical engineering, automotive, and all kind
of man
-
machine cooperation.


*) Source: “A Strategy for Microelectronics in Europe”, White Paper, Members of the High
-
Level Group for KETs

© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

From Technology towards Solutions for Global
Challenges


Smart Integrated Systems
will be the principal enabler of innovative products
and solutions for most of the big societal challenges.


In the fields of urbanization and transportation, smart integrated systems
will be the basis for electrification of vehicles as well as for collecting and
distributing information, goods, and energy.


Building up a modern knowledge society has already changed the living and
working environment significantly creating “Electronic assistants”, which will
allow a more and more improving interaction between man and machine,
also a must in the health and inclusion arena.



Example:


The
smart phone
serving the
communication needs

in a
knowledge based society



© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

Grand Challenges


define relevant needs for the global society

Grand Challenges are a basis for actual and future markets, national as well as
global.

From a technical point of view, the most pressing topics for the future of Europe
will be


ageing population and health,


urbanization and mobility
,


climate and environment
,


Energy and raw materials,


living and working in a knowledge based society

© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

»Mobility«



-

Quality of Life in Urban Environmets

Vision 2050:


Cities with
emission free
zones


Seamless transportation systems


Increasing importance of infrastructure:



Energy, Water, Information, Social Networks

Challenges:


-

Multi
-
Media everywhere


-

Storage and transport of huge amounts of data


-

Electro mobility & driver assistance


-

Storage of electrical Energy


-

highly complex linked systems
; Smart Grids

Competences:


-

Smart Integrated Systems


-

eMobility


-

Communication

& Infotainment


-

Power Electronics


-

Reliable Electronics



© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

Trends in Automotive


Electronic components in the automotive industry generated revenue of
$105,264 million in 2010 by growing at a rate of 11.2 percent.


Hybrid/electric vehicles have more electronic content than traditional ones.


About 25% of global vehicles will be Green Cars (Hybrids, EVs, Alternate
Fuels) by 2015


Active safety electronic units are expected to grow strong


Driver assistance systems are projected to have the fastest growth rates
among safety electronics systems..


Increased use of consumer electronics and computing products in vehicles is
expected


Source: Increased Electronics Content in Vehicles Creating Opportunities for Electronic Companies

Frost & Sullivan, Dec 2011





© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

From Semiconductor to Automotive Application (1)

Electronics content



2000: 155 $

2010: 320 $

2020: 590 $





ZVEI Trendanalyse bis 2015; March 2011

© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

From Semiconductor to Automotive Application (2)


The Car
-

A Chip Set on 4 Wheels

© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

From Silicon Wafer to Automotive Application (3)

Chip

Package

Sensor

Silicon
-
Wafer

© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

Example: Accident Prevention by Optical Sensing


H. Schröder, G. Jordan, G. Lang, J. Hofmann,

R. Jordan, H. Oppermann, A. Klein, A. Gerritzen

Fraunhofer IZM / TU Berlin


IR LED


IR Sensors


Camera

Module

© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de


Example: Intelligent Electric Drives (Fraunhofer IISB)


Drives
with

system

integrated

inverter
(s)

Single
wheel

axle

drive


for

hybrid
cars

and

small


electric

vehicles

(2x 20 kW, 2x 500
Nm
)

Single wheel axle drive

for light
-
trucks and buses

(2x 80 kW, 2x 2.000 Nm)

Wheel hub motor

A project of „Fraunhofer Systemforschung Elektromobilität“


funded by
BMBF

© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de


Example: Intelligent Battery Systems (Fraunhofer IISB)


High
-
voltage DC/DC
Converter
(60 kW,
h


97%, air
-
cooled)

Modular Battery Cell Stack


(incl. cell monitoring and active balancing)


LiFePO
4

cells (A123)


Nominal voltage: 320 V


Energy: 2,4 kWh

ICE Starter Battery

(14 V, Li
-
Ion)

14V Power
-
net DC/DC Converter

(14.4 V, 2.5 kW)

Multi
-
functional V2G
Interface

(DC/AC converter)

BMU

(battery management
unit)

© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

Grand Challenges


define relevant needs for the global society

Grand Challenges are a basis for actual and future markets, national as well as
global.

From a technical point of view, the most pressing topics for the future of Europe
will be


ageing population and health
,


urbanization and mobility,


climate and environment,


Energy and raw materials,


living and working in a knowledge based society

© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

»Smart Living«


Vision 2050:


Networked,
adaptive environments
for optimal


work
-
life balance, personalized education systems;


Individualized production;


New services
and business models

Challenges:


-

Highly complex networks


-

Ubiquitous electronic assistance: sensors and actuators


-

Multi
-
Media everywhere


-

Storage and transport of huge amounts of data


-

Autarkic systems

Competences:


-

User
-
centric human
-
machine
-
interface


-

Smart systems design & integration


-

Communication & infotainment


-

Power supply for autarkic systems



© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

Development of Human Machine Interface

Steam Engine ICE Train Japanese Toilet Brain Interface


Yesterday

Today

Tomorrow?



Source Wikipedia

© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

Why
Smart Integrated Systems
forHMI?


Application of More
-
than
-
Moore technologies will
make the environment
smart
. Appliances will
become
intelligent

and
context sensitive



the
will become
Smart Integrated Systems


Smart Integrated Systems
will extend
communication among human beings

as well
as
between machines
and
between humans
and machines
.


Technological basis for all these visions are further
miniaturization
,
heterogeneous integration
and
functional extension of today’s electronics and
microsystems.





© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

Smart Integrated Systems


the Future of HMI

© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

Application: Human Machine Interface


Gold microstructures for nerv connectors





Implantable electronics





Retina Implant

Source: Fraunhofer IZM (2), Retina Implant (1)

© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

Source: ITRS Roadmap

Europe 2020




Technology Trends
: More Moore & More
than

Moore



© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

Europe 2020




Technology Trends: More Moore & More than Moore




Grand Challenges will need
Smart Integrated Systems
at the end of the day



Europe is (still) leading in
Diversification (More than Moore)
,

mere
Miniaturization

(More Moore)

has gone to Far East



Smart Integrated Systems
is the smart combination of both




Therefore, Smart Integrated Systems require up
-
to
-
date
technology for both worlds:

»More More« as well as »More
-
than
-
Moore«


© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

Europe 2020




Smart Integrated Systems


„Made in Europe“





Smart Integrated Systems
are the basis for most
system solutions
,
necessary to meet the global challenges


Europe still maintains whole
value chains
for those products


Many European
sme companies
are world leaders in these areas



To support those companies Europe needs a suitable
technology validation
platform

based on the outstanding research work of European RTOs and
Pilot Lines for the production



Moreover, a European
Smart Integration System Foundry / Pilot line
is
necessary to satisfy the needs of especially small and medium sized
enterprises which are usually not served by big semiconductor foundries



The European
KET program
might be the right approach


© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

Europe 2020




Technology Validation & Smart Integrated System Foundry





Heterogeneous Technology Alliance

© Fraunhofer MIKROELEKTRONIK

www.mikroelektronik.fraunhofer.de

Concluding Remarks


Future product development will be driven by requirements of the Grand
Societal Challenges


There is a strong need upcoming for technical (electronic) assistance
everywhere;
Smart Integrated Systems
are key to success


Europe still has all technologies available to tackle with innovative product
ideas based on
Smart Integrated Systems
.


Europe is still leading in
Smart Integrated Systems
,

this position has to be maintained and strengthened


But we need foundries and pilot lines open for sme companies





a big chance, but also a big challenge for the European Economy