表 A10-1 一般及專業理論課程綱要表

actorrattleUrban and Civil

Nov 15, 2013 (3 years and 7 months ago)

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Department

Electronic Engineering

Course Title

E
lectronic
M
aterials and
A
pplication

Scheduled

T
hird school year,
S
econd semester

Credit Hours


3

Prerequisite Course(s) or Previous Knowledge


Fundamental Physics, Electronics,
Engineering Mathematics

Co
urse Goals


1.

To understand the basic characteristics and physical meanings of solid physics and
material science

Knowledge

.

2.

To understand the principl
e

and application of
e
lectronic
m
aterials

and device
design

Skills

.

3.

To have the specialized attitudes of
semiconductor/photoelectron professional men


Attitudes

.

4.
To understand the present status of semiconductor/photoelectron market and the
trend in the future

(Other)
.


C o u r s e D e s c r i p t i o n


U n i t/To p i c

D e s c r i p t i o n

C o n t a c t
Ho u r s

C o mme n t s

I n t r o d u c t i o n t
o
E l e c t r o n i c
Ma t e r i a l s A p p l i c a t i o n



1.

O b j e c t i v e

s c h e d u l e

s c o r e

2.
I n t r o d u c t i o n t o E l e c t r o n i c
Ma t e r i a l s

3


S t r u c t u r e o f s o l i d

1.

B o n d i n
s o l i d

2.

S t r u c t u r e o f c r y s t a l

9


E l e c t r o n i c p r o p e r t i e s o f
s o l i d s

1.

R e s i s t a n c e o f ma t e r i a l s

2.

E l e c t r i c c o n d u c t i v i t y

o f
ma t e r i a l s

3.

H a l l e f f e c t

6


p
-
n j u n c t i o n a n d d e v i c e s

1.

s e mi c o n d u c t o r ma t e r i a l s

2.

p r i n c i p a l o f
p
-
n j u n c t i o n

3.

p
-
n d i o d e

4.

L a s e r d i o d e

9


O p t i c a l p r o p e r t i e s o f
s o l i d s

1.

B e h a v i o r o f l i g h t i n s o l i d

2.

p h o t o e l e c t r i c e f f e c t

3.

I l l u mi n a t i o n D e v i c e

9


Ma g n e t i c p r o p e r t i e s o f
s o l i d s a n d
1.

S o r t s o f
ma g n e t i c
ma t e r i a l s

9


supe
rconductivity

2.

Soft magnet

and hard magnet

3.

Superconductivity and
Superconductive properties

Microelectro Mechanics
,
sensors and packing
materials

Introduction and the trend in
future of Microelectro Mechanics
,
sensors and pa
cking materials

3