Title of presentation goes here

yakzephyrΤεχνίτη Νοημοσύνη και Ρομποτική

24 Νοε 2013 (πριν από 3 χρόνια και 7 μήνες)

48 εμφανίσεις

Department of Electrical and Computer Engineering

SDP team Yngvesson


Ioan Tihenea

Tomas Broka

Dmitriy Stupak

Sergey Derivolkov

IR CARBON NANO
-
TUBE TRANCIEVER

Department of Electrical and Computer Engineering

Outline


Recap Design Overview


System Overview


Signal Processing Block (Transmitter End)


Transceiver


Signal Processing Block (Receiver End)


Suspension Method


Fabrication Techniques Used


Current Status and Group Breakup


Questions




Department of Electrical and Computer Engineering

Recap Design Overview


For our Senior Design Project we are working
on creating a communication system that has two
computer interface terminals, some signal
processing at each end and an Infrared
communication channel (transceiver) in the center.


The key component to our SDP project is a
Single Walled Carbon Nanotube (SWNT) thin film
detector detecting IR radiation which changes the
resistivity across it; this will be interpreted in
binary values.

Department of Electrical and Computer Engineering

Outline


Recap Design Overview


System Overview


Signal Processing Block (Transmitter End)


Transceiver


Signal Processing Block (Receiver End)


Suspension Method


Fabrication Techniques Used


Current Status and Group Breakup


Questions

Department of Electrical and Computer Engineering

System Overview

Computer Interface
Signal
Processing
Transceiver
Computer Interface
Signal
Processing
Input from
keyboard by user
CPU
USB
Interface
Software
Multiprocessor
Digital to
Analog circuit
Focusing Lenses
USB Cable
IR Radiation
2
wire cable
Legend
Bolometer
Analog to
Digital Circuit
Multiprocessor
USB
Interface
CPU
Display
Software
System Block Diagram
LED emiter
SWNT film
Detector
Department of Electrical and Computer Engineering

Outline


Recap Design Overview


System Overview


Signal Processing Block (Transmitter End)


Transceiver


Signal Processing Block (Receiver End)


Suspension Method


Fabrication Techniques Used


Current Status and Group Breakup


Questions

Department of Electrical and Computer Engineering

Signal Processing Block (Transmitter End)


Microcontroller


IR LED and Circuitry


Silicon Laboratories


SiLabs

C8051F340


USBXpress


Department of Electrical and Computer Engineering

Outline


Recap Design Overview


System Overview


Signal Processing Block (Transmitter End)


Transceiver


Signal Processing Block (Receiver End)


Suspension Method


Fabrication Techniques Used


Current Status and Group Breakup


Questions

Department of Electrical and Computer Engineering

Transceiver

Department of Electrical and Computer Engineering

Outline


Recap Design Overview


System Overview


Signal Processing Block (Transmitter End)


Transceiver


Signal Processing Block (Receiver End)


Suspension Method


Fabrication Techniques Used


Current Status and Group Breakup


Questions

Department of Electrical and Computer Engineering

Signal Processing Block (Receiver End)


Amplifier and Comparator


Circuitry for clean pulses


Microcontroller

Department of Electrical and Computer Engineering

Outline


Recap Design Overview


System Overview


Signal Processing Block (Transmitter End)


Transceiver


Signal Processing Block (Receiver End)


Suspension Method


Fabrication Techniques Used


Current Status and Group Breakup


Questions

Department of Electrical and Computer Engineering

Suspension Method



Fabrication of Supporting

Washer


Electrical Contacts


Connecting SWCN Film

to Supporting Washer






Department of Electrical and Computer Engineering

Outline


Recap Design Overview


System Overview


Signal Processing Block (Transmitter End)


Transceiver


Signal Processing Block (Receiver End)


Suspension Method


Fabrication Techniques Used


Current Status and Group Breakup


Questions

Department of Electrical and Computer Engineering

Fabrication Techniques Used


Plasma etching premade film


Film was placed in oxygen plasma to etch down to
required thickness.


Vacuum filtration method


Pour CNT solution onto membrane and vacuum non
-
CNT liquid out. Then dissolve membrane.


Dry drop method


Place electrical contacts on glass slides and putting
drops of the CNT solution between them.

Department of Electrical and Computer Engineering

SEM Image

Department of Electrical and Computer Engineering

Outline


Recap Design Overview


System Overview


Signal Processing Block (Transmitter End)


Transceiver


Signal Processing Block (Receiver End)


Suspension Method


Fabrication Techniques Used


Current Status and Group Breakup


Questions

Department of Electrical and Computer Engineering

Group Breakup

Sergey Derivolkov, EE:


Designed
the system overview and helped provide more efficient procedures for the
fabrication. Also used SEM to take pictures of the NanoComp film and measured the
thickness.



Dmitriy Stupak, EE:


Designed the circuitry to test the film resistivity and the effects of IR radiation. He
also joined Ioan during plasma etching procedure and used Profilometer to measure
the thickness of the etched film.



Tomas Broka, CSE:


Worked on fabrication procedure for the first couple films. Tomas also set up the
website of the team and he is in charge of ordering components, equipment, and
keeps contacts up to date through emails and through the website. Also he worked
with SEM to take images.



Ioan Tihenea, EE:


Worked on plasma etching procedure for the film offered by NanoComp. He used
Atomic Force Microscope (AFM) to take images of the films surface. He also was
involved as well as Tomas in the fabrication.


Department of Electrical and Computer Engineering

Outline


Recap Design Overview


System Overview


Signal Processing Block (Transmitter End)


Transceiver


Signal Processing Block (Receiver End)


Suspension Method


Fabrication Techniques Used


Current Status and Group Breakup


Questions

Department of Electrical and Computer Engineering

Questions

Department of Electrical and Computer Engineering

SiLabs C8051F340 Microcontroller


48
MIPS 8051 CPU


64
kB

Flash memory


4352
B RAM


USB 2.0


Integrated transceiver


Integrated clock recovery


4
kB

buffer RAM


Full (12 Mbps), or low
-
speed operation


Control endpoint plus six bi
-
directional
endpoint pipes


10
-
bit, 200
ksps

ADC


Two
asynchronous
comparators


Voltage reference


Temperature sensor


40
Digital I/O