Status of the power electronics industry

wideeyedarmenianΗλεκτρονική - Συσκευές

24 Νοε 2013 (πριν από 3 χρόνια και 8 μήνες)

84 εμφανίσεις

©

2012

75 cours Emile Zola, F
-
69100 Lyon
-
Villeurbanne, France

Tel: +33 472 83 01 80
-

Fax: +33 472 83 01 83

Web: http://www.yole.fr

Status of the power electronics industry

A comprehensive overview of the power electronics
semiconductors business

Delphi

©
2012 •

2

Main applications of Power Devices

Power Devices are used in:

IT & consumer

Automotive

Industry

PFC / power
supplies

Converter /

inverter

DC/DC

Converter

DC/AC

inverter

Inverter

Electronic appliances

& Computing

UPS

Hybrid automotive

Motor
control

P.V.

Wind
turbines

< 500 W

1


5 kW

30


350 kW

5


100kW

5


50kW

> 1MW

UPS

100kW

1MW

Rail transport.

Power distribution

Power range

Medium to high power electronics applications: focus of this report

©
2012 •

3

PM

Power Modules or discrete

(Discretes MOSFET or IGBT + free
-
wheel
diodes in a single package)


IPM

Intelligent Power Modules

(Inverter IC: Drivers + sensors + control + IGBT

or MOSFET + diode)

Can be monolithic (Hitachi) or Hybrid (Fairchild)

Drivers IC

(Gate drivers + protection + control)



Definition of the power electronics chain

MCU

Drivers: Control &
Protection stage

Power stage

Command &

Instructions

PIM / CIB

Power Integrated Modules

or Converter Inverter Break

(Discretes MOSFET or IGBT inverter + bridge +
break shopper a single package)

Focus of this report:
discrete and modules

©
2012 •

4

IPM definition: Monolithic or Hybrid

Source: Fairchild

IPM

Monolithic

All devices are designed and
processed on a single chip

Hybrid

several chips linked by
wires in a single package

Source: IR

©
2012 •

5

What’s an inverter ?

Different types of modules


Depending on power range, configuration, size and cost
several type of power modules can be used
used

in inverters:

Single switch power module:

For 3.3kV and more

2in1

power modules

6in1 module

7in1 module

7
in1 module + diode
rectifier

Integrated power modules (for low power applications)
can be used, but are not studied in this report

©
2012 •

6

What will those devices be used for?


Each of those advanced power devices has specificities for different uses, which will depend on:


Material properties


Cost


Technological availability

600 V

+1200 V

200 V

Super
Junction
MOSFET

Super
Junction
MOSFET

SiC

GaN

High
-
end
solutions

Middle
-
end
solutions

Low
-
end
solutions

Silicon
IGBT

Silicon
IGBT

GaN

Super
Junction
MOSFET

Silicon
IGBT

Super
Junction
MOSFET

2015 Technology Positioning Forecast

© Yole Développement.
July 2012

©
2012 •

7

Inverter’s markets and drivers

And

o
thers…

Drivers for inverter
innovation

Drivers for application
growth

Size reduction

Weight reduction

Efficiency
improvement

Cost reduction


Increase of
oil/energy
price


Demand
and regulations
for
clean energy


Need
for
mass transportation


Need for efficient transportation


Regulation on energy efficiency


Data center
and data
storage market
increase


Utility grid stress increasing due to the
use of clean energy

Depending on
applications

Wind turbines

AA B$

+5.8%

PV inverter

XX B$

+3.7%

Motor drives

18 B$

+CC%

Rail traction

ZZ B$

+5.3%

UPS

BB B$

+1%

EV/HEV

YY B$

+29.3%

Inverter markets

©
2012 •

8

Power Electronics


2011


2020 value
-
chain analysis: wafer, device, system

Electronics Systems

$122 B

Power Inverters

$41 B

Semiconductor power
devices (discrete and
modules)

$XX

Power
wafers

$XX B

Electronics Systems

$YY B

Power Inverters

$YY B

Semiconductor power
devices (discrete and
modules)

$YY B

Power
wafers

$YY B

2011

2020

CAGR: ZZ%

CAGR: +8.1%

CAGR: XX%

CAGR: XX%

©
2012 •

9

Market forecasts

Introduction


Power electronics market is expected to reach
$20 billion in 2012
, including
discrete, modules and power ICs.



Discrete will still represent the largest share of this market: 70%.


Mostly driven by low voltage MOSFETs, rectifiers and IGBTs.



However, we expect
modules to represent XX% of the market in 2020
,
instead of 15% today.



In this module segment, IGBT modules remain the biggest sub
-
segment,
especially driven by medium to high voltage applications (over 600V).


However, we expect low voltage ones (200


600V) to increase, especially with the
entry on the market of low voltage IGBTs for consumer applications.



Main
players

of the power
electronics

industry

are
Infineon
, Mitsubishi
Electric, Toshiba,
Vishay
, STMicroelectronics

©
2012 •

10

2006
-
2020 overall PE market size, split by device type

All applications

It includes:


Power discretes: MOSFET, rectifier, IGBT, Bipolar….


Power modules: IGBT, diode or MOSFET modules, IPM


Power IC: power management IC: mainly voltage regulators (POL) and drivers

Source: Yole Développement

Power discrete and modules market

©
2012 •

11

Top
-
20
Power
Semiconductor

(based on
sales estimation of discretes, modules and IPM) (excl.
mixed signal, driver, logic…)

Source: Yole Développement

* 2011 revenues not fully available when report been published

©
2012 •

12

Top 20 power semiconductor players mapping

Who is doing IGBTs?

A large amount of the top 20 players
are Japanese.

Important companies vertically
involved in the power electronics
industry: module makers, inverter
manufacturers, system integrators,…

IGBT dies producers

IGBT modules
packagers

©
2012 •

13

SJ MOS Market Forecast to 2016

Split by applications

SJ MOS Market Forecast to 2016


Total

$ 441,5 M

$ 497,9 M

$
564,7
M

$ 637,6 M

$ 713,7 M

$ 799,5 M

$ 892,9 M

© Yole Développement. May 2011

©
2012 •

14

SJ MOS applications

1kW

100kW

0

P o w e r

10kW

1MW

Power supply / PFC

EV/HEV

UPS

Motor drive

Wind Turbine

PV inverter

Rail traction


DC bus voltage is too high


Current is too high


No need for high frequency switching


Need for low cost solutions

200W

2kW

20kW

200kW

PV micro
-
inverter

Desktop
computer
power supply

Consumer
SMPS

LED
drivers

HID Lamp ballast

Amperage need is too high

!

Amperage need is too high

!


Using other than H
-
bridge
structure, we can use SJ MOS in
~10kW inverters.


Limited DC bus will be higher


Applications will be extended in:


PV inverters


Motor drives


EV/HEV

Moving
towards
higher
power

SJ MOS inapplicable in this range

SJ MOS used in this range

© Yole Développement. May 2011

©
2012 •

15

SiC Device Sales in 2010

A $XXM business on the open market

2010 analysis of merchant sales of SiC devices for commercial
applications, on the open market,
out of defense
-
related
business and R&D contracts

Careful! For numerous SiC
device makers,
overall
revenues can more than
doubled

thanks to
R&D
contracts

and
defense
-
related

activities.

Compared to 2008 and 2009 figures, Infineon has now definitely taken the lead in the business. In the
coming years, we assume that companies already connected to the Power Electronics business like STM or
Rohm may significantly increase their market shares

Others are 2010 merchant activities from:

-

MicroSemi

-

Shindengen

-

GeneSiC

-

TranSiC

/ Fairchild

-

Sanrex

-



©
2012 •

16

Power GaN: a Question of Business Model…

GaN
-
on
-
Si epiwafer


Tomorrow?

Business Model
: Sale epiwafers to CMOS power
pure
-
players willing to enter in the GaN industry
without investing in MOCVD reactors

Silicon
Epitaxy




SiC Epitaxy








Power Device manufacturer

Front
-
End




Si CZ Wafer




SiC wafer


Power Device manufacturer

Front
-
End









Si FZ thin
-
wafer

Epi can be integrated at wafer vendor side or at device
maker side or subcontracted to an epi
-
house

Si or SiC

Track 1

Si Track 2

Power Device manufacturer

Front
-
End









Today:


Power

device

makers

usually

buy

polished

Silicon

wafers,

conduct

the

epi

(or

buy

Si

epi
-
wafers)

if

needed

(FZ

thin

wafer

doesn’t

require

epitaxy)

then

process

the

devices
.

This

model

is

the

same

for

SiC

technology
.


For

those

who

plan

to

enter

in

the

GaN

field,

2

scenarios

could

occur
:


Some

may

probably

not

integrate

MOCVD

GaN

epitaxy
.

They

will

buy

GaN

epiwafers

and

process

it

in

the

existing

CMOS

Front
-
End

lines,

as

they

use

to

do

with

Silicon

substrates

(or

SiC)


Some

will

try

to

fully

integrate

the

GaN

process,

from

the

bare

silicon,

the

GaN

epi

and

the

Front
-
End


In

Power

applications,

we

don’t

see

any

business

potential

for

GaN

templates


©
2012 •

17

SJ MOS supply
-
chain

End markets

Packaging

Manufacturing

Design

?


Desktop PC
adapters


Laptop PC
adapters


Light
ballast


LCD TV


DC/DC
converters


PV
inverters


UPS




?

?

© Yole Développement. March 2012

©
2012 •

18

Relative interest of
SiC

introduction

High temp.

High freq.

Smaller devices

Low losses

Now

2011

Future

2015

Now

2011

Future

2015

Now

2011

Future

2015

Now

2011

Future

2015

Automotive

Rail

Motor

drives

T&D

PV

Wind
turbines

Others

Application dependent

Low interest

L
imited interest

Strong interest

©
2012 •

19

Power electronics
SiC device
manufacturing

Origin of SiC involvement

From SiC material
to SiC device

From Si to SiC device
technology

New entrant

SiC pure
-
player

From others III
-
V to SiC
device technology







©
2012 •

20

Power device manufacturers

Origin of GaN involvement

Si power pure
players

New entrants

GaN pure
-
player

Semicon global
players with GaN
LED activity

SiC power

Si power players
already involved in

III
-
V & Compounds

LED pure
players











©
2012 •

21

Estimate of architecture cost (in $/kW)

Power

1kW

10kW

100kW

1MW

Specific design: DC/AC + PWM

NPC architecture

H
-
bridge architecture

Specific design: DC/AC + PWM

Inverter IC



H
-
bridge architecture

Over this power level,
architectures do not impact so
much on reliability.

Passives, packaging and
connectivity do.

Single phase /
three phases
transition

3
-
phase NPC architecture

3 x 1 phase

3
-
phase bridge architecture

3
-
phase bridge architecture 3 x 1 phase

3
-
phase bridge
architecture

3
-
phase bridge architecture 3 x 1 phase

No
preferred
choice

$XX/kW

(at inverter module level)

$XX/kW

(at inverter module level)

$YY/kW

(at inverter system level)

$YY/kW

(at inverter system level)

$YY/kW

(at inverter system level)

$XX/kW

(at inverter module level)

YY$/kW

(excluding drivers and passives)

$XX/kW

(at system level)

©
2012 •

22

Supply chain

Vertical integration by Chinese companies

Rail

EV/HEV

PV inverter

Wind turbines

System

Inverter

Power module

Power device

Infineon set up a power device fab in Goldwind facility

Strong R&D effort

Dynex acquisition enables access to power semiconductor
technologies

?

©
2012 •

23

POWER ELECTRONICS

AT YOLE
DÉVELOPPEMENT

©
2012 •

24

Yole missions in
Power Electronics


Our missions in
Power Electronics:


Help
device and system
manufacturers
to
expand their product
portfolio taking advantages from the
PE
specificities.


Devices:


Active (switches)


Passive: capacitors, resistors, inductors, connectors, bus bars


Systems:


Inverters, converters, drivers



Help
material and equipment makers
to diversify their offer,
understanding new technologies and new
challenges:


Materials for wafers


Materials for passive components



Help
start up

in the
PE
domain to have a good representation of this
market, accompany them on a business plan and on partnerships and
investors seeking

©
2012 •

25

A complete offer for your activities in

Power Electronics

Cost simulation tool

Reverse engineering and
reverse costing services

Market and technology reports

Power Fab database

©
2012 •

26

Our market and technology reports

Available Nov. 2012

Available Sept. 2012

Available Oct. 2012

©
2012 •

27

Our reverse engineering and reverse costing reports

©
2012 •

28

Our custom services


Market research and technology evaluation and benchmarking


Marketing teams services



Marketing services


New product developments and start
-
ups support



Competition analysis


Marketing and product manager services



Strategy consulting


Executive services



Reverse engineering and reverse costing missions

©
2012 •

29

Our team


A dynamic team active all across the supply chain and
with a worldwide perspective!

Eng. Brice LE GOUIC

Power Electronics activity leader

Expert in inverters and power
electronics semiconductors

Eng. Alexandre AVRON

Market and technology analyst
Expert in power devices and
power packaging

Eng. Wenbin DING

Market and technology analyst

Expert in passive components
and Chinese market investigation

Eng. Leandro CASSARINO

Market and technology analyst
Expert in
PowerStacks