N Na an no os sc ca al le e F Fa ab br ri ic ca at ti io on n a an nd d D De ev vi ic ce es s - - C Co on nc ce ep pt ts s a an nd d A Ap pp pl li ic ca at ti io on ns s

sodaspringsjasperΠολεοδομικά Έργα

15 Νοε 2013 (πριν από 3 χρόνια και 11 μήνες)

85 εμφανίσεις

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Shalom J. Wind

Office: 1020 Schapiro CEPSR

Phone: 212
-
854
-
5122

email: sw2128@columbia.edu

ELEN E6945






3.0 points






Call #




Lecture

Topic

1

Introduction:

Nanostructures and nanodevices

History


(“Breakthroughs” in nanofabrication)

ITRS Roadmap

General approaches to fabrication and characterization


“Top down” vs. “bottom


2

Thin film processing I

Deposition techniques

Cha
racterization


3

Lithographic patterning

Basic concepts

Materials

Radiation/matter interactions


4

Photon
-
based lithography I

Resolution limits

Exposure systems


5

Photon
-
based lithography II

Short wavelength techniques

Near
-
field techniques


6

Electron beam lithography

Probe formation

Exposure systems

Electron
-
solid interactions


7

Midterm

8

Ion/Atom beam lithography

Scanning probe techniques

Nanoimprint & “soft lithography”


9

Thin film processing II

Pattern transfer

Characterization


10

Self
-
assembly

Directed self
-
assembly


11

Biologically driven synthesis

Biomolecule
-
mediated assembly



12

Design & Integration


13

Applications






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Shalom J. Wind

Office: 1020 Schapiro CEPSR

Phone: 212
-
854
-
5122

email: sw2128@columbia.edu

ELEN E6945






3.0 points






Call #


Course Outline


I.

Introduction:

a.

Course outline

b.

Nanostructures and nanodevices

i.

Histor
y

of nano




Breakthroughs” in nanofabrication

ii.

ITRS Roadmap

c.

General approaches to fabrication

i.

Nano
-
architecture

ii.

Lithography

iii.

Film structuring

d.

“Top down” vs. “bottom up”

e.

Going from “the idea” to “the device”

II.

Thin films

a.

Why are they important for nanodevices?

b.

Deposition

i.

Evaporation

ii.

Sputtering

iii.

CVD

iv.

MBE

v.

ALD

c.

Characterization

i.

Thickness

ii.

Morphology

III.

Lithographic patterning

a.

Introduction

i.

Basic concepts: Lithographic processes

1.

Exposure

2.

Development

3.

Pattern transfer

ii.

Controlling where exposure occurs (i.e., where radiation goes)

b.

Radiat
ion
-
matter interactions

c.

Lithographic materials

i.

resists

1.

sensitivity

2.

resolution

ii.

masks

d.

Photon
-
based lithography

i.

optical lithography

1.

basic concepts

2.

exposure systems

3.

resolution limits

4.

holographic (interference) lithography

5.

phase shifting


6.

distortions

7.

OPC

ii.

EUV

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Shalom J. Wind

Office: 1020 Schapiro CEPSR

Phone: 212
-
854
-
5122

email: sw2128@columbia.edu

ELEN E6945






3.0 points






Call #


iii.

x
-
ray

iv.

near
-
field

e.

Electron beam

i.

probe formation

1.

Types of probes

a.

Gaussian

b.

Shaped beam

2.

sources

3.

electron optics

4.

distortions and correction

ii.

exposure systems

1.

throughput

2.

resolution

3.

placement accuracy

iii.

electron
-
solid interactions

iv.

electron scattering and proximity ef
fects

1.

distortions

2.

correction algorithms

v.

MeV lithography

f.

Ion beam

i.

Masked IBL

ii.

Focused IBL

iii.

ion optics

iv.

exposure systems

g.

Atom lithography

h.

Scanning probe

i.

“mechanical” lithography

ii.

electron emission

iii.

hydrogen depassivation

iv.

dip pen lithography

i.

Nanoimprint and
stamping

i.

direct imprinting

ii.

sfil

iii.

laser
-
induced molding

IV.

Pattern transfer

a.

Liftoff

b.

Etching

i.

Wet etching

ii.

ion milling

iii.

reactive ion etching

1.

mechanisms

2.

geometric loading

3.

modeling

c.

Electroplating

V.

Chemical self
-
assembly

a.

Self
-
assembled monolayers

b.

Three
-
dimensional self
-
organized systems

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Shalom J. Wind

Office: 1020 Schapiro CEPSR

Phone: 212
-
854
-
5122

email: sw2128@columbia.edu

ELEN E6945






3.0 points






Call #


i.

Zeolites

ii.

Mesoporous films

iii.

Binary surfactant systems

iv.

Liquid crystals

c.

Templated self
-
assembly

d.

Nanocrystals

e.

“Directed self
-
assembly

VI.

Biologically inspired assembly

a.

Biomolecule
-
inorganic interactions

b.

Synthesis

c.

Assembly

d.

DNA scaffolding

e.

DNA
-
mediated assembly

f.

Other biomolecular assembly approaches

VII.

Characterization

a.

Microscopy

b.

Surface analysis

c.

Chemical analysis

VIII.

Device integration

a.

Process flow

b.

Process design

IX.

Applications

a.

Examples

i.

Electronics

ii.

Optics

iii.

Biology