Research Internship in Science and Engineering, 2010 Location: HP Labs, Bangalore, India

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Research Internship in Science and Engineering, 2010

Location: HP Labs, Bangalore, India

About Indo
US Science & Technology Forum:

The Indo
US Science & Technology Forum (IUSSTF)

is an
mous, not
profit society that has been established under an agreement
between the Governments of India and the United States of America on March 21, 2000
with the mandate to promote and catalyze Indo

U.S. bilateral collaborations in science,
gy, engineering and biomedical research through substantive interaction
between academia, industry and governmental agencies of the two countries. The
IUSSTF supports innovative programs aimed to

foster scientific excellence by
capitalizing on the scientif
ic & technological synergy of the two nations.

About RISE Program:

US Science and Technology Forum (IUSSTF) has launched Research Internships in
Science and Engineering (RISE) to create unique opportunities for science, technology,
engineering and me
dical students from the United States to undertake internships in
national laboratories, federal research centers, academic research institutes, and
private R & D laboratories in India. Objectives of the internships are to provide
students with unique oppo
rtunities to live and work in an international context, to gain
practical experience, and acquire professional skills. Internships are envisaged as a
source of mutual cultural and professional enrichment for both the interns and their
host institutions.

bout HP Labs, India:

HP Labs India was established in February 2002 with the principal focus on creating
new technologies for addressing the IT needs of the next billion customers for HP. A
large majority of these new customers arise from rapidly growing
markets such as
India with distinct technological, social and economic characteristics. By understanding
this context deeply, HP Labs aims to create new and relevant technologies


U.S. Citizen

Open to science, engin
eering, technology and medical disciplines

Ph.D and Master students currently enrolled at a regionally accredited institution of
higher education in U.S.

Internship Duration:


6 months

Fellowship includes:

Internship covers return airfare, monthly

stipend and accommodation allowance.
However, the overseas travel insurance is expected to be borne by the selected intern.


Multimodal HCI interaction (including paper
based interaction)

Simplifying web access, services and applications

Cloud ap
plications and services

Communications and networking

Mobile computing including devices

Innovations in business models

Systems architecture and design

Software and hardware developers

Application Submission Deadline:

15 March 2010

Internship begins:

May 2010