Preliminary Design Review

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2 Νοε 2013 (πριν από 3 χρόνια και 9 μήνες)

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Preliminary Design Review


Northwest Nazarene University

Advisor: Dr. Lawrence


Chad Larson

Ben Gordon

Seth
Leija

David Vinson

Zach Thomas

Drew Johnson


Section 1: Mission Overview


Purpose


Goals


Theory


Success


Benefits


Expected Results


Concept of Operations


Section 2: Design Overview


Design
Process


Design Requirements


System Overview


Design View


Superhydrophobic


Flexible

Chips


Radiation Hardened Chips


Data / Sensors


Block Diagram


Prototyping Plan


RockSat
-
C 2012 User

s Guide Compliance


Shared Can
Logistics


Section 3: Management


Team Organization


Budget


Work

Breakdown
Schedule


Timeline


Risk Factors


Section
4: Conclusions



Study the feasibility of using
superhydrophobic

materials in the presence
of high acceleration and
vibrations for
possible use on space missions.



Test Radiation Hardened chips and new
flexible chips with American Semiconductors


Do research on
superhydrophic

material that
would allow it to be used in future space
missions.



Gather data on Radiation hardened chips and
to gain experience working with the
microchip industry.




W
hen water is in contact
with the
superhydrophobic

surface (diatomaceous
earth) it is more attracted to
its own surface tension than
it is to the material. This is
because the material works
like a microscopic bed of
nails. Diatomaceous earth
is a new material developed
by John Simpson at
Oakridge National
Laboratory and is
exceptional due to its high
contact angle with water
and low price.




For
this mission to be considered a success,
the SH material needs to be recovered and
tested
post
-
flight. It would be best if the
superhydrophobic

material survived the flight.



Get usable data from the radiation hardened
chips



The goal of this launch is to prove that this
diatomaceous earth can survive a rocket launch and
still be functional post
-
flight.



This material could have many different benefits if it
is shown to survive space travel. The SH material has
already been shown to work in microgravity by NNU
and NASA’s Reduced Gravity program.
NASA would
benefit from the data gathered if they decide to use
this material on future missions.



Provide data to American Semiconductors about their
radiation hardened chips.






It is hypothesized that the material will
survive the high acceleration and vibrations
and still be functional in post
-
flight testing.


It is expected that the radiation hardened
chips will make less errors in the flight
compared to the non
-
hardened chips.

Concept of Operations

Rocket Launch/G
-
switch triggered

Time =1.3 min

Height: 75km

Start of main
chip data


Time=2.8 min

Apogee of Flight

Best data on chips
gathered


Time= 4.5 min

Height: 75km

Main chip data
complete

Time=5.5 min

Chute is
deployed

Time= 15 min

Lands in ocean


Design Superhydrophobic Encasement


Design American Semiconductor Board/ Final
Design of Plate.


Build encasement/Build American
Semiconductor board.


Implement into Plate


Test board


Run full flight test



Physical Envelope Cylindrical:



Diameter: 9.3 inches



Height: 4
.75
inches


Mass Canister + Payload = 20
±
0.2
lbf


Center of Gravity Lies within a 1x1x1 inch
envelope of
the
RockSat

payload canister‘s
geometric centroid.


A Superhydrophobic “donut” will be on one
plate


Along with that is the Flexible chips attached
to small cylinders.


The electrical systems will be on another
plate above the original plate.

Superhydrophobic “donut”

Flexible
Chips

American Semiconductor
Board

Geiger Counter

“Donut”


A donut shaped hollow
object will house
Superhydrophobic
material. This shape
allows for different
forces on different
axis.


This will be on the
lower plate and will be
placed around the
center support.

Flexible Chip Cylinders


New flexible chips
from American
Semiconductors will be
placed on different
axis to find effects of
space travel on them.


American Semiconductors will work with
students to design a board which will test
their
r
adiation hardened chips

American Semiconductor Board

&


Geiger Counter


Time


Radiation


Geiger Counter


American Semiconductor data will be stored
on a flash memory.

Radiation
Hardened
Chip

FleX

Clock/Signal

Power

Memory

Geiger
Counter


Between now and the CDR, the
superhydrophobic

enclosure will be in
production. The American Semiconductor
plate will be fully designed and the actual
AVR board will be in production.


Predicted mass
-

10lb


Using
Rocksat

Workshop Plexiglas plate


Diameter


9”


Height


3” to 4.5”



A g
-
switch will be used for activation



Using deionized double contained water



We will share a canister with the
RockOn

Workshop.


We will stay in contact with Colorado via
e
-
mail and keep then updated with our
design.


We will be using standoffs.

Electrical

American
Semiconductors

David Vinson

Seth
Leija

Drew Johnson

Mechanical
-

Superhydrophobic

Ben Gordon

Chad Larson

Zach Thomas

Item


Amount Budgeted ($)


½ Can


$7000.00 paid by American
Semiconductors

Superhydrophobic

Material


Made

by NNU for l
ess then
$50.00

Travel


Funded by Idaho Space Grant


Facilities

Provided by NNU


Radiation

Hardened Chips and
Electronics

Provided by American
Semiconductors

Electrical/

American
Semiconductors

Design

Fabricate AVR

Build

Mechanical/

Superhydrophobic

Complete
Design

Begin
Fabrication of
Enclosure

Paint material on
interior of “donut”

Complete
design on SH
subsystem

Nov 14

Preliminary
Design with
American
Semiconductors

Begin
Fabrication

Nov 30

Finalized
Design

Jan 30

Complete
Fabrication

Complete
Fabrication

Electrical Subsystem

Mechanical Subsystem

Begin Testing

Begin Testing


Risk 1: SH
e
nclosure
breaks


Risk 2: G
-
switch fails
to start data collection


Risk 3:Malfunction on
electrical board.

Consequence



Risk 1

Risk

2

Risk 3

Possibility


The main focus before the CDR will be
completing the design of the American
Semiconductor board and begin the
construction of the board.


Begin fabrication of
superhydrophobic

enclosure.


Questions?